Wide-Temp Rugged Embedded Boards Perform 24/7 in Extreme Environments | Automation.com

Wide-Temp Rugged Embedded Boards Perform 24/7 in Extreme Environments

Wide-Temp Rugged Embedded Boards Perform 24/7 in Extreme Environments

DFI has launched new industrial motherboards powered by the latest Intel® Atom™ processor E3900 family (code name Apollo Lake). For the new series boards, DFI has created a wide array of rugged and reliable products including Mini-ITX, SBC, Pico-ITX, COM Express, Qseven R2.1, and SMARC R2.0. These boards deliver higher computing capabilities and stunning graphics performance at economically low-power consumption that average at only 9 watts TDP. Moreover, they support the extended temperature range from -40°C up to +85°C, which provide appropriate industrial hardware in embedded applications such as transportation, automation, energy, military or aerospace. Key Features Equipped with industrial-grade components, these boards support a wide temperature range of -40 to 85°C durable for any industrial and harsh environments. The new series powered by enhanced graphic engine supports 4K high resolution (DP: 4096x2304 @ 60Hz) and three independent displays for multimedia solution. New design on embedded boards: proprietary EI/O extension interface to provide flexibility; up-to-date M.2 interface for high-speed storage; advanced thermal solution that makes good system integration.

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