Beckhoff to feature automation and IT convergence at Pack Expo 2017

Beckhoff to feature automation and IT convergence at Pack Expo 2017

August 29, 2017 – The Beckhoff Automation booth (S-6302) will feature automation technology (AT) and IT convergence at Pack Expo 2017 in Las Vegas. The Beckhoff system architecture for packaging machine automation promotes control hardware consolidation by advancing PC-based control technology.

North America’s premier packaging industry event, Pack Expo takes place September 25 – 27, 2017 at the Las Vegas Convention Center. Visitors to the Beckhoff booth will again be able to “BYOD”, using their own smartphones and tablets to connect with PC-based control demos – including a wall of IoT-enabled devices, plus articulated robot arms from Stäubli – using any mobile device with a web browser. Cloud connectivity will be a connecting thread throughout the Beckhoff booth and in machine builder booths, such as groninger USA (N-107).

Additional Smart Factory solutions will factor heavily throughout the Beckhoff booth, such as One Cable Automation via EtherCAT P, which integrates the previously separate power and signal lines into a single, standard 4-wire Ethernet cable. The latest motor and drive solutions with One Cable Technology (OCT) will also be shown in the form of demos and test stands for hands-on evaluation.

A key highlight at PACK EXPO 2017 will be TwinCAT HMI, an HMI software platform from Beckhoff for visualizations that can scale to suit the screen formats of industrial displays and any mobile device with a web browser. Based on leading web technologies such as HTML5 and JavaScript, TwinCAT HMI allows the user to develop platform-independent user interfaces that are “responsive”, meaning they automatically adapt to the screen resolution, size and orientation of the device at hand. With the graphical editor, controls can be easily arranged via drag-and-drop and linked with real-time variables. TwinCAT HMI is extensible on all levels.

With TwinCAT IoT and TwinCAT Analytics, packaging machines can directly benefit from Industrie 4.0 and IoT applications. Engineering efficiency is increased because the software packages share the same universal platform as all other packaging machine programming tools from Beckhoff, including PLC, motion control, safety, HMI, robotics/kinematics and much more.

The ELM series EtherCAT I/O modules feature metal housings that optimize shielding and cooling in measurement technology applications. At the same time, the durable housings provide flexibility at the interface level, such as for LEMO or BNC plug connectors or for the well-established cage clamps, as a customizable and standard solution. Measurement accuracy of 100 ppm at 23 °C, precise sub-1 μs synchronization, 24 bit resolution and a sampling rate of up to 50,000 samples per second guarantee data acquisition.

The C6015 Industrial PC (IPC) opens up application areas for PC-based control technology. Fully suited to industrial applications, this IPC measures 82 x 82 x 40 mm, demonstrating the scalability of PC-based control technology from Beckhoff. The Microsoft Azure Certified C6015 is designed for machine control and IIoT applications. Intel Atom processors are available, including those with multi-core technology up to 4 Cores. These features facilitate implementation of automation, visualization and system-wide communication in small- and mid-size applications with a minimal device footprint. As a result, the device opens up areas of use where PC-based control technology has not been used thus far, or where motherboards must be integrated as expensive, custom solutions.

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