Saki releases 2Di-LU1 inline bottom-side automated optical inspection (AOI) system

The 2Di-LU1 software includes Saki's Fujiyama algorithm, which provides through-hole joint inspection in a single step. It simultaneously inspects for copper exposure, pin detection, pin-holes, solder fillet abnormalities, missing components, soldering problems, and bridges. Saki's inspection software has been used for extra component detection of solder balls and foreign objects and through-hole device inspection in the automotive industry for several years and complies with the IPC-A-610 standard.
The platform and construction of the 2Di-LU1 bottom-side AOI system is based on Saki's hardware. The system supports L-size PCBs, high clearances, heavy substrates, and mounted jigs.
Saki will feature its 2D bottom-side AOI system, along with its 3D AOI, SPI, and AXI systems and Saki Self-Programming Software, at NEPCON China, Shanghai, China, in the Saki booth 1J30 and the Fuji booth 1G60, being held April 24-26 and at SMTconnect, Nuremberg, Germany, in Hall 4A133 being held May 7-9.
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