Balluff introduces BOH00EZ wafer mapping sensor | Automation.com

Balluff introduces BOH00EZ wafer mapping sensor

January 212020
Balluff introduces BOH00EZ wafer mapping sensor

January 21, 2020 — Balluff’s wafer mapping sensor, BOH00EZ, utilizes a photoelectric sensor for detection of semiconductor wafers and slotting errors in FOUPS – front opening unified pods. Especially designed for use with thin end effectors, it features a controlled and focused light spot, allowing it to detect wafers a few μm thick.

Based on photoelectric Micromote technology, it features an LED sensor in a sensor head measuring 2.4 x 1.5 x 7 mm. 

In addition to wafer mapping, this sensor delivers capabilities that can be used for a variety of applications that require through beam sensors in a small area, such as Life Science and Food and Beverage applications.

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