Beckhoff Automation introduces the C6032 Industrial PC (IPC)

April 18, 2019 –Beckhoff Automation has introduced the C6032 Industrial PC (IPC). With dimensions of 129 x 133 x 104 mm, the C6032 IPC is designed to enhance the scalability of the PC-based controller portfolio from Beckhoff. A device in a modular design, the C6032 adds two slots for PCIe Compact modules to the C6030 single-board IPC, which is comparable in terms of computing power, to accommodate modular interfaces and functional extensions. With the use of compact PCIe modules, the C6032 can be adapted to the requirements of individual applications.

Equipped with Intel Core i processors of the 6th and 7th generation – up to the Core i7 with four 3.6 GHz cores – the C6032 works to support multi-axis motion control, HMI applications, short cycle times and handling of large data volumes. The motherboard and the die-cast zinc and aluminum housing were developed according to the standards of Beckhoff – such as industrial-grade assembly, Made in Germany quality and reliability. Other features include the design typical of the C60xx IPC series and the flexible installation options with vertical or horizontal mounting at the rear of the enclosure.

The C6032 features two PCIe compact module slots that enable flexible expansion of the connection area on the front of the device. The first available PCIe modules are the following:

• 2 x Gbit Ethernet
• 2 x USB 3.0
• 2 x RS232
• 1 x CP-Link 4 (for connection to Beckhoff industrial displays)

The use of a durable, speed-monitored and controlled fan makes the C6032 suitable for an operating temperature range of up to 55 degrees Celsius. Available options include Windows 7 or Windows 10 operating systems as well as a second M.2 SSD in RAID configuration. The C6032 also offers storage capacity of 40 GB M.2 SSD, 3D flash even in the basic configuration.

The Microsoft Azure-certified devices in the C60xx IPC series are designed to meet current requirements in machine building. Designed with all these requirements in mind, the device generation is suitable for use in a range of application scenarios, including distributed architectures and current Internet of Things (IoT) or Industrie 4.0 concepts. The computing power is flexibly scalable to suit nearly all medium to high-end machine performance levels:

• C6015 and C6017 for medium performance requirements with Intel Atom CPUs (up to four cores)
• C6030 and C6032 as high-end devices with Core i processors with up to 3.9 GHz per core (for dual core processors)