- April 26, 2017
- DFI Inc.
- DFI Inc.
The combination of the 6th generation Intel¬Æ Core‚Ñ¢ processor and DFI‚Äôs high quality production ensures that the new SBC is equipped with high speed CPU performance, powerful 4K-capable graphics, DDR4, and Windows 10 support.
The newly launched SBC performed excellently in the market. The combination of the 6th generation Intel® Core™ processor and DFI’s high quality production ensures that the new SBC is equipped with high speed CPU performance, powerful 4K-capable graphics, DDR4, and Windows 10 support. Moreover, DFI’s new SBC products have various dual or quad processors options that enable clients to have a suitable motherboard that fits their needs. DFI has devoted numerous efforts integrating and optimizing the functionalities of their SBCs, therefore differentiating themselve from other competitors. This begs the question: how does DFI deliver more optimal solution with the 6th generation Intel® Core™ processor in their SBC products when compared with their competitors? As mentioned above, DFI’s new SBC products (such as SU551, SU251/253) can be perfectly applied in space-constrained industrial environments that require fast and stable computing capabilities. To completely meet customers’ needs, DFI is not only able to maintain previous SBC generations’ excellent features (such as rich I/O ports), but is also able to provide customized Expansion I/O port that can satisfy additional requirements and optimize solutions for various applications in a cost-effective way. Firstly, regarding the heat dissipation capacity with the special design of placing the processor on the back of the board, making it closer to the enclosure of case, the new SBC can now run up to 100% CPU capacity consistently without overheating. Secondly, and perhaps even more noteworthy, DFI has adopted FloTHERMAL as its electronic thermal analysis tool to predict airflow, temperature, and heat transfer in and around components, boards, and electronic equipment. With the strict FloTHERMAL software, DFI developed the optimized proprietary heat spreading technology and ensured that the new SBC could dissipate heat at an accelerated speed. To increase the flexibility for the design of embedded solutions within limited space, DFI’s new SBC supports three types of power connectors (including DC Jack, vertical type, and right angle type) to ensure minimum requirement of space for DC-in. The 6 OS that the new SBC supports (including Windows 7, Windows 8.1, Windows 10, Debian 8, CentOS 7, and Ubuntu 15.10) allow clients to select the one that is most suitable for their solutions. Moreover, we also provide demo images from Linux to Windows OS to help clients integrate their system faster and easier. To sum up, DFI steadfastly considers various requirements in order to produce the best SBC for different applications. The SBC embedded with the new 6th Generation Intel® CoreTM Processor is DFI’s answer to space-limited environments that requires excellent performance, for instance, Automated Guided Vehicles (AGV), and robotic arm control. With MTBF of more than 100K hours and an organizational goal to keep the DPPM under 200, DFI’s new SBC is built with both premium features and reliable qualities to meet clients’ needs.Learn More
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