- July 20, 2020
The dawn of the Artificial Intelligence (AI) era will render the usual playbook of continuous shrinking and packing more and more transistors into chipsets will become unsustainable.
Hong Kong - July 21, 2020 - With the dawn of the Artificial Intelligence (AI) era upon the world, the usual playbook of continuous shrinking and packing more and more transistors into chipsets will become unsustainable. New chip architecture, materials and manufacturing processes will be needed, in order to meet the requirements and realize the potential of the AI-enabled world.
IBM Research has been at the forefront in the development of AI-optimized hardware and process innovation globally. As a global leader in the Advanced Packaging and Heterogeneous Integration solutions, ASMPT will provide a suite of Integrated Solutions for Heterogeneous Integration (including ALSI Laser Saw/Grooving and state-of-the-art interconnect tools, inclusive of collaboration on next generation hybrid bonding) in support of IBM AI Research. ASMPT product solutions can help to improve performance, power and cost for nextgeneration AI chips.
Comments from Dr. Mukesh Khare, Vice President, Systems Research at IBM Research: “The future of AI computing performance depends on the development of hardware that meets the fast-growing demands of emerging AI workloads. We are pleased to work with ASMPT to advance packaging and Heterogeneous Integration solutions for AI hardware research in the IBM Research AI Hardware Center.”
Comments from Mr. Lim Choon Khoon, Senior Vice President at ASMPT: “The exponential cost of recent silicon scaling has created an inflection point for the industry. It is driving the development of Heterogeneous Integration (HI) to augment step up performance versus comparable Systems on Chip (SoC). This is being achieved through HI's “open” capability to dis-integrate and re-integrate silicon and chiplets, allowing flexible choices to achieve optimal performance at significantly lower costs. The timely confluence between IBM’s Heterogeneous Integration roadmap and ASMPT’s advanced packaging technologies and tools makes us natural strategic collaboration partners to tap the massive potential for innovation and better performance in semiconductor solutions.”
Finally, ASMPT is both excited and privileged to be among the companies driving the effort of developing the next generation AI chip technology with world renowned industry leaders like IBM.
About ASM Pacific Technology Limited (“ASMPT”)
As a global technology and market leader, ASMPT, develops and provides leading edge solutions in surface mount technology, equipment and materials for the semiconductor assembly and packaging industries. Its surface mount technology solutions are deployed in a wide range of end-user markets including electronics, mobile communications, automotive, industrial and LED. Our continuous investment in research and development help to provide our customers with innovative and cost-efficient solutions and systems that enable them to achieve higher productivity, greater reliability and enhanced quality.
Listed on the Hong Kong Stock Exchange since 1989, ASMPT is currently one of the constituent stocks on the Hang Seng Composite MidCap Index under the Hang Seng Composite Size Indexes, the Hang Seng Composite Information Technology Industry Index under Hang Seng Composite Industry Indexes and the Hang Seng Hong Kong 35 Index.
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