Lifecycle and Obsolescence Management: Extending Control System Lifespans

  • By Lee Boggs
  • September 04, 2025
  • Sealevel Systems, Inc
  • Feature
  • Sponsored
Lifecycle and Obsolescence Management: Extending Control System Lifespans
Lifecycle and Obsolescence Management: Extending Control System Lifespans

Eventually, every automation system faces obsolescence, and failing controller hardware can derail uptime. However, a modular architecture lets you turn disruptive replacements into routine, predictable maintenance.

In automation systems, the controller is central to reliability, performance and integration across process control, operator interfaces and safety. When controller hardware ages out of production or reaches end-of-life, entire systems risk shutdown because critical components are no longer supported.

Traditional controller replacements often trigger rewiring, system revalidation and certification cycles, all of which carry cost, time and risk. A steadier approach is employing a modular architecture.

A modular architecture lets you upgrade compute modules while keeping I/O wiring and control logic intact, reducing disruption and extending system life. In environments where even brief downtime can create safety risks or production losses, this approach helps teams protect operations, budgets and uptime without sacrificing flexibility or long-term value.


Lifecycle forecasting

Smart asset management starts with spotting trouble before it hits. Lifecycle forecasting maps the expected life of controllers and key components so replacements are planned, not rushed. It ties part availability to your maintenance calendar, which lowers disruption and cost. The goal is to gain lead time and avoid last-minute buys.

Modern controller platforms often use a two-board modular design: a computer-on-module (also called compute module or COM module) with the CPU, memory, storage and high-speed interfaces and a carrier board for field connections and application-specific I/O. That split matters for forecasting because risk in the compute layer points to a module swap while risk in the I/O layer points to a carrier revision.

Lifecycle forecasting enables you to track compute-first indicators and market signals such as CPU and chipset lifecycle notices, BIOS and firmware windows and OS and driver roadmaps. Then you add supplier updates, I/O component availability and broader supply-chain shifts.

For example, when a compute part such as the CPU moves into the red, plan to swap the computer-on-module and keep the existing carrier board and field wiring. When an I/O part moves into the red, plan a carrier revision and continue using the same module. In both cases, the unaffected layer stays put, which shortens the outage and narrows revalidation to only what changed.

Prioritize COM modules and CPUs early in their lifecycle, then select I/O parts to match. That sequencing stretches upgrade intervals and steadies inventory planning. Fold long-term availability commitments and parts traceability into your forecast so decisions are based on evidence, not guesswork.

Keep the process cross-functional. Engineering, procurement and supply-chain teams should review forecasts together, approve substitutes and set inventory buffers. Document assumptions, dates and owners in one place, then review regularly so the plan stays current. Handled this way, obsolescence management becomes routine work.


Obsolescence and end-of-life mitigation

Parts go out of production, suppliers shift plans and suddenly a controller refresh becomes a rushed retrofit that interrupts operations or forces a costly redesign. A steadier path combines planning with modular design.

One practical move is to separate compute from I/O. Build so that field wiring lands on a stable carrier interface rather than on the compute board itself. If the COM module reaches end-of-life, replace that module and leave the I/O layer and wiring alone. This keeps the change small and contained.

Modular systems that follow standard carrier board and computer-on-module formats have shown they can swap compute across generations without starting over on panel layout or I/O connectivity. The impact of obsolescence shrinks to a planned board change rather than a full rebuild.

You can also extend the life of installed assets with compatibility tactics. Add adapters or interfaces that let legacy I/O stay in service while you modernize the compute side. This kind of retrofit preserves investments, reduces waste and supports digital continuity goals.

The design principle is to separate compute from I/O with plug-compatible, backward-compatible system interfaces. Land field wiring on stable carrier connectors, not on the compute board. Decoupling compute from control wiring lets you upgrade processors, operating systems or algorithms with far less disruption. That separation is the foundation for future-proofing performance.


Future-proofing modular architecture

The payoff for separating compute from I/O is long-term flexibility. COM modules plug into a carrier board to form the controller’s processing layer. Built to open standards such as COM Express and COM-HPC, they package the CPU, memory and high-speed interfaces in a compact, replaceable unit.

The carrier is designed once for plant signals and stays put. Over time, you can drop in newer COM modules for performance or power gain. The processing layer evolves while the I/O layer and wiring remain unchanged. That stability preserves prior validation and shortens outages during upgrades.

In short, a modular architecture keeps the physical layer steady and lets the processing layer evolve. With that architectural baseline in place, the next step is a practical roadmap for planning and executing upgrades.


Roadmap to long-lasting automation

Catalog your compute, I/O and wiring. Start with compute: module family and type, CPU generation, memory, storage, BIOS and firmware levels, OS and driver versions. Then map I/O: analog, digital, serial, Ethernet, device interactions and where each signal lands. With a complete catalog, future compute swaps are replacements instead of rewires.

Adopt a two-board computing approach. Keep processing on a COM module and land field wiring on a stable carrier board. That way, you can upgrade the compute side without disturbing downstream wiring or control logic.

Verify lifecycle compatibility. Select modules with multi-year availability and published lifecycle guidance. Confirm I/O component availability. Plan refresh intervals so you schedule upgrades instead of reacting to obsolescence in a crisis.

Pilot before you roll out. Choose a non-critical segment to pilot modular swaps. Validate form, fit and function compatibility, I/O preservation and software continuity before adoption across the plant.

Align upgrades with capital and maintenance windows. Schedule computer-on-module replacements during budgeted capital projects or planned maintenance outages. When timing and availability line up, changes become routine rather than disruptive.

Record every configuration. Track compute module versions; image and OS details; BIOS and firmware levels; and carrier revisions, I/O pin maps and connector details. Good records make the next swap faster and repeatable.

Handled this way, obsolescence turns from a potential emergency into planned work, protecting uptime and capital while keeping the control platform modern.


Sustaining lifespan through modular design

A planned migration to modular design turns control system obsolescence from an emergency into scheduled work. By separating the processing layer from the I/O layer, forecasting component lifecycles and aligning changes with planned capital projects and maintenance outages, organizations ensure operational continuity and reduce both cost and risk.

This approach preserves wiring and prior validation, so teams can improve performance without reopening panels or repeating certifications. Treated as an ongoing program, this strategy keeps compute performance and I/O integrity in lockstep as technology advances, redefining lifecycle management from reactive fix to proactive stewardship.
 
This feature originally appeared in the August/September issue of Automation.com Monthly.

About The Author


Lee Boggs is a content specialist for Sealevel Systems, Inc., a designer and manufacturer of embedded computers, industrial I/O, and software for critical communications. An experienced customer communicator and technical writer in government, healthcare, and IT, Boggs creates content for Sealevel’s technical community and business partners.

Download the August/September issue of Automation.com Monthly

Did you enjoy this great article?

Check out our free e-newsletters to read more great articles..

Subscribe