Products for Discrete Manufacturing & Machine Control

ADVANCED Motion Controls Introduces Extended Environment FlexPro Digital Servo Drives

ADVANCED Motion Controls® has just added three PCB mount servo drives with CANopen® communication and Extended Environment capabilities to the FlexPro® drive family.

Microchip Delivers Accuracy and Energy-efficiency of Current Monitoring in High-temperature Automotive Applications

• Microchip

New high-side current sense amplifier offers the industry’s lowest offset for AEC-Q100 Grade 0 qualified devices, enabling a more accurate and energy efficient current measurement solution for those applications exposed to extreme temperatures.

TWK Presents a Safety Encoder with Ultra-compact Dimensions

With the TRK38, TWK introduces an ultra-compact single-turn magnetic encoder developed with safetyoriented applications in mind.

Curtiss-Wright Launches New Motor Support Program For Exlar Universal Actuators

• Curtiss Wright Controls, Inc.

Curtiss-Wright’s Actuation Division announced the release of its new ASSIGN™ motor program for Exlar® FTX and FTP Series actuators.

LK Metrology Introduces Ultra-accuracy Portable Measuring Arms

LK Metrology has now expanded its FREEDOM arm range of 3D articulating arm metrology systems, or portable measuring arms, with the launch of five ultra-accuracy models in both 6-axis and 7-axis variants.

Bosch Rexroth’s BSHP and BASA: 20,000 km Without Relubrication

• Bosch Rexroth

Ball rail systems and ball screw assemblies with longer lubrication intervals reduce operating costs and protect the environment.

STMicroelectronics' Complete Energy-Meter Evaluation Board that Combines Low-cost Sensors and Robust Galvanic Isolation

• STMicroelectronics

Accelerates time to market leveraging ST’s long expertise in utility and industrial metering applications.

Pro-face America Releases Customizable Industrial PC for the Most Unique Application

• Pro-face America

Pro-face America announces the release of the new PS6000 Modular IPC Series.

Siemens and ASE Introduce Enablement Technologies for Next-generation High Density Advanced Package Designs

• Siemens

The new high-density advanced packaging (HDAP) enablement solutions stem from ASE’s participation in the Siemens OSAT Alliance–a program designed to drive faster adoption of new HDAP technologies like 2.5D, 3D IC and Fan-Out wafer-level packaging (FOWLP) for next-generation IC designs. ASE is a leading provider of independent semiconductor assembling and test manufacturing services.

ABB's Braking Distance Simulator Improves Safety, Reduces Robotic Cell Footprint by up to 25%

• ABB

ABB’s RobotStudio now offers unprecedented accuracy for calculating robot stopping distances to optimize operator safety.