Festo introduces N2 purge system for silicon wafer manufacture

  • July 13, 2020
  • Festo Corporation
Festo introduces N2 purge system for silicon wafer manufacture
Festo introduces N2 purge system for silicon wafer manufacture

July 14, 2020 — The Festo N2 purge system for silicon wafer manufacture is designed to reduce the risk of oxidation caused by particle contamination. This Festo system is ideal for Front Opening Unified Pod (FOUP) applications by maintaining a consistent, low-particle nitrogen supply. It is the latest Festo innovation for automation in the semiconductor industry.

The unit’s peak particle size per switching cycle approximates 0.1 μm, which is about five times smaller than most N2 purge systems. Closed-loop control ensures an accurate, stable, and linear flow rate – without hysteresis. Repetition accuracy is rated at +/-0.25% of setpoint.

Low-friction piezo technology prolongs service life and minimizes maintenance. For reduced risk of leakage, this purge system has only two pneumatic connections. No assembly, testing, or additional stainless-steel tubing and fittings are required.
 

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