- June 01, 2020
June 2, 2020 - KEMET Corporation, a supplier of electronic components, extends its KC-LINK range using KONNEKT packaging technology to meet the growing demand for wide bandgap (WBG) semiconductors, EV/HEV, LLC resonant converters, and wireless charging applications. This technology combines KC-LINK’s C0G Base Metal Electrode (BME) dielectric system with KONNEKT’s Transient Liquid Phase Sintering (TLPS) material to create a surface mount multi-chip solution suited for both packaging and applications.
Available in commercial grade with tin termination finish, this series is Pb-Free, RoHS and REACH compliant. Capacitors utilizing KONNEKT technology have the unique ability to be mounted in a low-loss orientation to increase their power handling capability further.
Combining KEMET’s Class 1 C0G dielectric system with KONNEKT technology offers a low-loss, low-inductance package capable of handling high ripple currents with no change in capacitance versus DC voltage and negligible change in capacitance versus temperature. Designed for an operating temperature range up to 150°C, the capacitor can be mounted close to fast switching semiconductors. These components are positioned for growth within the DC/DC converter market in aerospace, medical and automotive applications.