- May 16, 2022
May 13, 2022 - Chipsets are extremely small with heights averaging approximately 0.5mm. Because of this, chipsets can be difficult to inspect for cosmetic defects or finding chipsets that are overlapped or "stacked" during production. Although a conventional 2D area scan camera is useful for detecting cosmetic defects, it is unsuitable for identifying stacked chipsets. Likewise, a 3D camera is ideal for detecting stacked chipsets, it may not be able to identify scratches on the chips. Moreover, if a user has a limited and compact working space for the inspection process, utilizing both a 2D and a 3D camera would be inefficient in terms of space and cost.
With these requirements, the Chromasens 3DPIXA compact 15µm camera is highly suitable as the camera simultaneously acquires both 2D color images and a 3D point clouds or depth maps. The camera is also able to detect overlapped chipsets or ones that are out of alignment, as it will show different colors on the depth map based on the height differences at line scan speeds of up to 310mm/s.
The Chromasens 3DPIXA compact 15µm camera is equipped with a Tri-linear CCD Sensor (RGB) and provides optical resolution accuracy of 15 µm/pixel over a large field of view (40mm). This allows users to check for micron-sized defects, such as scratches or dents, or to conduct further OCR (Optical Character Recognition) on the chipsets.
In these types of applications it is strongly recommended that users deploy the Chromasens Corona II Tube Light, which helps to produce a soft, diffused light from all directions, illuminating all sides of the chipsets. This setup is suitable for detecting object defects that require height information (z-coordinate) such as PCBs, wire bonds, or metal surfaces.
The camera comes with the Chromasens 3D-API for software integration, and supports libraries from HALCOM, MIL, LabVIEW and Coake.