- June 26, 2019
June 26, 2019 – Telit announced the ME310G1 and ME910G1 modules, designed for mass-scale LTE-M and NB-IoT deployments that feature hundreds of thousands or millions of devices. Based on the Qualcomm 9205 LTE modem and featuring optional 2G fallback, the modules also provide a future-proof foundation for IoT deployments that span legacy networks, 4G and 5G.
The ME310G1 and ME910G1 are the first 3GPP Release 14 additions to the Telit portfolio and the first members of Telit’s series based on the Qualcomm 9205LTE IoT Modem, which was announced in late 2018. The chipset enables Telit to meet booming global demand for modules for applications such as wearable medical devices, fitness trackers and industrial sensors.
The modules are suited for battery-powered applications via features such as Power Saving Mode (PSM) and extended Discontinuous Reception (eDRX), which periodically wakes up the device to transmit only the smallest amounts of data necessary before returning to sleep mode. Both modules also ensure indoor connections, with a maximum coupling loss of up to +15dB/+20dB.
The multi-band ME310G1 and ME910G1 are available in versions with 2G fallback for use in areas where LTE-M/NB-IoT service is yet to be deployed. These versions also support GSM voice and will support VoLTE for applications that require the ability to make phone calls.
The ME910G1 is the latest member of Telit’s xE910 and family. The ME910G1 is also a drop-in replacement in existing devices based on the family’s modules for 2G, 3G and the various categories of LTE.
The ME310G1 LTE-only variant is less than 200mm2 and variant with 2G fallback is less than 300mm2 and they enable enterprises to deploy small footprint designs across many application areas including asset tracking, health-care monitoring, smart metering, portable devices, industrial sensors, home automation, and others that benefit from low-power and low-data rate capabilities. The xE310 family’s flexible perimeter footprint includes pin-to-pin compatible 2G and 4G modules, enabling integrators to design a single PCB layout and deploy a combination of technologies.
ME310G1 and ME910G1 samples are now available. Mass production begins in late 2019 and Q1 2020, depending on the product version.