- July 26, 2018
July 26, 2018 – Somic America announced that they will unveil a new machine to the North American market at PACK Expo, October 14-17 in Chicago. The SOMIC-FLEX III represents a new concept designed to give customers an advantage in the marketplace with flexibility, speed and other benefits.
The patent-pending SOMIC-FLEX III addresses requests from retail chains in the North American market looking for upright, two-part cardboard packaging. A manufacturer for end-of-line packaging technology, Somic is known for its design and development capability.
Customers will have the ability to produce any type of packaging carton, ranging from a single wraparound carton to a multiple-component cover-tray-carton combination. Customers will also have the option to group products in an upright position or lying flat.
This capability is being driven by a Rockwell Automation control system. The SOMIC-FLEX III also is equipped with UL certified components. All machines for the North American market will be fully supported by Somic America’s new headquarters in Minnesota.
Somic engineers will be in the booth at PACK Expo to answer any questions. For more information, visit www.somic.us.