- March 27, 2017
- ULVAC Technologies, Inc.
March 27, 2017 - ULVAC introduced the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for uniform Descum and Ti etching processes. Higher data transfer speeds require high-density packaging technologies, while advanced mobile and wireless devices require thinner and higher-pin-count IC packages. Fan-Out Wafer Level Packaging (FO-WLP) is widespread, while Panel Level Packaging increases substrate size from 300mm to 600mm. While there are many 200mm/300mm wafer dry etching systems in the market today, there was no dry etching system for 600mm substrate, providing for a uniform Descum process and Ti etching process. ULVAC developed the system to address this need, and support mass-produced packaging processes. The plasma source is also applicable to fluorine gases, so seed layer Ti etching, which requires a wet process, can proceed without side etching. SiO2 and SiN etching is available on the NA-1500 as well. The NA-1500 dry etching system also provides stable transfer and processes without abnormal discharge, ensuringing warpage from the enlarged substrate is never an issue.