- September 16, 2013
- DFI Inc.
- DFI Inc.
September 16, 2013 - DFI releases RL830-C602-J/C604 motherboard in the EATX form factor, with the Intel C602-J/C604 chipset and support for dual Intel Xeon E5-2600 v2 processors based on 22nm process technology providing higher intelligent performance with more cost-effective and energy-efficient power consumption than previous generations. Increased memory capacity supported by DDR3 DRAM technology for x4, x8, and x16 devices is provided with 16 DDR3 DIMM sockets with 4 memory channels per processor delivering the maximum performance up to 512GB at 800/1066/1333/1600MHz low voltage memory storage for faster communication between components. The 1 Intel Gigabit LAN controller supporting 4 RJ45 LAN ports integrates into the 1GB transceiver for increased transmission speed. The integrated VGA graphics controller offers higher outstanding graphics computing with up to 50% 3D graphics performance improvement. The RL830-C602-J/C604 EATX platform powered by dual Intel Xeon E5-2600 v2 processors offers higher performance and power with improved I/O controllers via the Intel C602-J/C604 chipset for the state of lowest-available power on workload requirements. The 8 USB 2.0 ports, containing 4 USB 2.0 ports, 2 external USB 2.0 ports, 1 embedded USB connector for eUSB SSD, and 1 vertical Type A USB 2.0 port for securing USB flash drive, allow a user's system to process more data load. This new embedded EATX platform also supports 2 Serial COM ports which support RS232 with hardware auto flow control to fulfill the demand of industrial applications. The integrated Advanced Host Controller Interface (AHCI) controller supports RAID 0/1/5/10. The RL830-C602-J offers 6 Serial ATA ports: 2 SATA 3.0 ports with data transfer rate up to 6Gb per second and 4 SATA 2.0 ports with data transfer rate up to 3Gb per second. The RL830-C604 provides 10 Serial ATA ports, including 2 SATA 3.0 ports and 8 SATA 2.0 ports. 4 PCIe x16 interfaces (PCIe 3.0, for high graphics displays) and 2 PCIe x8 interfaces (PCIe 3.0) are available on the RL830-C602-J/C604 platform for the additional expansion design in order to provide customers’ various demands. The RL830-C602-J/C604 EATX embedded motherboard offers a cost saving solution through better manageability and improved security which enables a user to better manage and secure a user's computers with client isolation, network filtering, security agents and anti-virus protection. All these features described above make it an ideal EATX platform for driving innovations in variety of compute-intensive embedded applications such as retail, medical, MAG, DSS, and industrial manufacturing. RL830-C602-J/C604 Features
- EATX form factor (305mm x 330mm)
- Dual Intel Xeon E5-2600 v2 processors
- Intel C602-J/C604 Chipset
- 16 DDR3 DIMM sockets support up to 512GB at 800/1066/1333/1600MHz, 4 channels system memory
- 1 VGA interface supports Aspeed AST 1400
- 4 RJ45 LAN ports
- 2 RS232 Serial COM ports
- 8 USB 2.0 ports
- - 4 USB 2.0/1.1 ports
- - 1 connector for 2 external USB 2.0/1.1 ports
- - 1 embedded USB connector for eUSB SSD
- - 1 vertical Type A USB 2.0 port
- SATA ports
- Intel C602-J chipset: 6 Serial ATA ports
- 2 SATA 3.0 interfaces with data transfer rate up to 6Gb/s
- 4 SATA 2.0 interfaces with data transfer rate up to 3Gb/s
- Intel C604 chipset: 10 Serial ATA ports
- 2 SATA 3.0 interfaces with data transfer rate up to 6Gb/s
- 8 SATA 2.0 interfaces with data transfer rate up to 3Gb/s
- 4 PCIe x16 interfaces (PCIe 3.0)
- 2 PCIe x8 interfaces (PCIe 3.0)
- Operating temperature range: 0°C to 50°C
- Storage temperature range: -20°C to 85°C
- Humidity range: 10°C to 90°C
All product specifications are subject to change without notice. About DFI Established in 1981, DFI is a leading supplier of high-performance computing technology worldwide. With more than 32 years of experience, DFI focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical diagnostic & imaging, ATM/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications. As an Associate member of the Intel Intelligent Systems Alliance, DFI works closely with Intel on development of next-generation standards-based building blocks, platforms and solutions for the communications and embedded market segments.
Go to DFI Inc. website
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