- August 09, 2013
- DFI Inc.
- DFI Inc.
August 9, 2013 – DFI releases HM960-HM86 Type 6 COM Express Basic module based on Intel HM86 Express chipset. This COM Express Basic module with BGA 1364 packaging technology is powered by the 4th generation Intel Core processor family built on 22-nanometer process technology offering higher processing performance, superior graphics display support, and evolutionary improvements in system memory and I/O interfaces. The enhancements in CPU performance, media and graphics capabilities, security and power efficiency in the 4th generation Intel Core processor family are driving innovation in intelligent systems in a variety of market segments such as industrial manufacturing. In system memory, support is provided for up to 2 16GB of DDR3L 1333/1600MHz low voltage memory interfaces for faster communication between components. The onboard memory storage, an optional SSD device, offers the persistent function of data storage. The integrated 4th generation Intel HD Graphics 4600 engine providing for smooth flash playback and rich 2D/3D graphics with high quality playback supports Intel Clear Video Technology that supplies advanced imaging capabilities for Blu-Ray and other high definition video processing such as image stabilization, gamut mapping and frame rate conversion. The enhancements in the instructions of Intel Advanced Vector Extensions (Intel AVX) 2.0 provide a significant performance improvement in integer and floating-point-intensive computations which are a key part of digital signal and image processing applications such as medical imaging and weather radar. Targeted at multimedia and medical applications, the HM960-HM86 brings additional features with Graphics APIs, including DirectX 11.1, OpenCL 1.2, and OpenGL 3.2 by supporting 3 display outputs in any combination of VGA, LVDS and DDI (HDMI, DVI, and Display Port) allowing you to choose the best combination to suit the requirements of various applications. VGA supported through the Intel HM86 Express chipset displays with resolution up to 2048x1536, and LVDS displays 24-bit, dual channel up to 1920x1200. The Intel HM86 Express chipset packed with high performance and flexible I/O capabilities provides increased mobile computing and graphics performance for the HM960-HM86 mobile platform. The integrated XHCI Host controller supporting up to 2 super speed USB 3.0 ports allows a system to process more data load and provide faster loading of frequently used applications. It also supports 8 USB 2.0 interfaces, High Definition Audio interface, 2 Serial ATA 3.0 and 2 SATA 2.0 interfaces for applications that need fast storage speed, 1 Intel Gigabit LAN controller to increase transmission speed for network-intensive applications, and 4-bit input and 4-bit output GPIO connector for device controls. The expansion design of this COM Express Basic module offers additional capabilities for the various demands via multiple PCIe configurations, including 1 PCIe x16 interface for high graphics displays and 7 PCIe x1 interfaces. Based on these combined features described above, the HM960-HM86 is a perfect mobile platform of embedded module for a whole range of applications requiring a stable revision-controlled platform, such as industrial control automation.
HM960-HM86 Features
- COM Express Basic Module (95mm x 125mm)
- Supports 4th generation Intel Core processors
- Mobile Intel HM86 Express Chipset
- Supports 2 DDR3L 1333/1600MHz SODIMM up to 16GB system memory
- Supports 1 VGA, 1 LVDS and 3 DDI interfaces for 3 display outputs
- 1 Intel Gigabit LAN interface
- 2 USB 3.0 ports
- 8 USB 2.0 ports
- Supports 2 SATA 3.0, and 2 SATA 2.0
- Supports 2 SATA 3.0, 1 SATA 2.0, and 1 SSD (optional)
- 4-bit input and 4-bit output GPIO connector
- 1 PCIe x16 interface
- 7 PCIe x1 interfaces
- SATA to SSD onboard (optional)
- Trusted Platform Module (TPM) – optional
- Temperature Range
- Operating: 0°C to 60°C
- Storage: -20°C to 85°C
- Humidity Range: 5% to 90%
About DFI Established in 1981, DFI is a leading supplier of high-performance computing technology worldwide. With more than 32 years of experience, DFI focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical diagnostic & imaging, A/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications. As an Associate member of the Intel Intelligent Systems Alliance, DFI works closely with Intel on development of next-generation standards-based building blocks, platforms and solutions for the communications and embedded market segments.
Go to DFI Inc. website
Go to DFI Inc. website
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