- June 22, 2010
June 22, 2010 - Acromag upgrades its I/O Server Industrial PC with an AMD Geode CPU to reduce costs as an alternative to PC/104 or CompactPCI embedded computers. Field I/O signals are interfaced through an internal carrier card with related plug-in I/O modules. Working together, the rugged, fanless box computer and conduction-cooled I/O modules provide a truly integrated system for many measurement and control projects. The Geode CPU processes the I/O signal data and manages numerous interface connections for peripherals and networking. Inserting a mix of up to four mezzanine IOS modules on the slide-out carrier card enables A/D, D/A, discrete monitoring/control, counter/timer, serial communication, and FPGA computing functions. High-density connectors on the front panel provide clean cable access for 192 channels of field I/O. Advanced heat management allows -40 to 75°C operation without open vents or fans. A Model IOS-7200 I/O Server PC starts at $1695.The compact design is also shock and vibration-resistant for mobile server and transportation projects such as rail or trucking. A wide temperature range satisfies the requirements of outdoor signage and display systems. Additionally, the interchangeable I/O modules offer flexible I/O configuration to easily accommodate continually evolving scientific research, simulation, data acquisition, and test & measurement projects.The IOS-7200 Industrial PC is equipped with an embedded AMD Geode LX800 500MHz CPU with 512MB of DDR400 DRAM that runs on Windows Embedded Standard or Linux. Standard interfaces include VGA graphics, two Ethernet ports, two serial ports, four USB ports, a CompactFlash slot, and audio input/output jacks. An internal 2.5 PATA hard disk or solid-state drive is accommodated as a user-installed option. More than 20 IOS modules are available to provide a wide variety of analog, digital, and serial I/O processing capabilities. A re-configurable FPGA module allows users to execute custom logic routines and algorithms on TTL, differential or LVDS I/O signals. Up to four IOS modules can be combined in any mix on the carrier card for flexible, high-density I/O to meet custom requirements. The IOS modules employ advanced heat sink techniques to manage excessive heat. A thermal pad wicks heat away from the module and transfers the energy to a conductive cover that contacts a large heat spreader plate within the I/O Server unit. Heat then moves to the enclosure walls where it is dissipated by external cooling fins.To simplify software development, Acromag offers several programmer support tools. A Windows development package provides API development software and Win32 DLL drivers, plus examples for C, Visual Basic, .Net, and LabVIEW environments. The Linux software includes a library of I/O function routines to speed code development. Both packages include demonstration programs with C source code to test and exercise the I/O module operation.I/O Server units have a rugged, extruded aluminum enclosure that is ideal for use in hostile industrial environments common in manufacturing, defense, transportation, and research applications. These units are resistant to shock (5g) and vibration (50g). Sophisticated thermal management techniques eliminate the need for vents or mechanics that could permit contaminants to enter or moving parts to fail. As a result, an I/O Server with four IOS modules operates reliably across wide temperature ranges between -40 to 75°C (-40 to 167°F) with 0-90% relative humidity, non-condensing. Acceptable storage temperatures range from -40 to 85°C (-40 to 185°F). CE, UL and cUL approvals are pending. FCC compliance meets FCC Part 15, Subpart B for Class A digital devices. The power supply requirement is 9-32V DC ±10% at 60 watts maximum. Power usage depends on the I/O modules used, but is typically about 30 watts.