- April 14, 2010
April 14, 2010 - FCI expanded its D-sub High Density series to address a growing number of applications where higher density packaging is required. FCI's High Density range previously consisted of right-angle female versions only. The additional range adds right-angle male, straight male and female, solder bucket male and female, and crimp male and female versions. This new connector range is ideal for applications requiring more signal density. Higher density connectors with same shell sizes provide 56% to 67% real estate savings on a printed circuit board compared with standard density connectors. The High Density D-sub series is available in contact layouts from 15 to 78 ways in all terminations. These connectors are operable for indoor applications with a temperature range from - 55°C to +105°C. Additionally, design-ins are simplified with distribution stock availability; 24-hour sample shipment; online drawings and specifications; short lead-times and reasonable minimum order quantities. FCI's full line of D-sub connectors is available on the web, including not only solutions for signal, but also for (mixed) power connectors. The new High Density range is part of FCI's IO-Connections portfolio, which provides customers access to a wide range of industry-standard and application-specific I/O interconnect solutions.