SICK announces Space-saving Photoelectric Sensors

  • June 17, 2010
  • SICK, Inc.
SICK announces Space-saving Photoelectric Sensors
SICK announces Space-saving Photoelectric Sensors

June 17, 2010 – SICK announced the MHTB15 and MHTB15V photoelectric sensors in a M18 cylindrical housing. These sensors also include SICK OES3 background suppression technology and IP69K rating for wash down applications. The MHTB15 features a plastic housing, making it appropriate for standard automation applications, especially where space is a concern. It is the shortest M18 sensor on the market. The sensor’s housing length measures 36.8 mm for the M12 connector version and 35.8 mm for the cable version. The MHTB15V with its stainless steel housing is designed for the heavy wash down applications, often required in the food and beverage industry that use cleaning methods such as HPLV (High Pressure Low Volume), CIP (Clean-In-Place), and SIP (Sterilize-In-Place). It is the shortest stainless steel M18 sensor on the market with a 52.9 mm long housing with M12 connector. Both sensors use a custom ASIC (application-specific integrated circuit) that incorporates OES3 technology to provide exceptional background suppression at an extended range of 300 mm. The OES3 chip contains proprietary technology that enables the sensors to ignore stray background reflections, detect multi-colored/shiny objects, and provide high immunity to ambient light, resulting in an increase in throughput. About SICKSICK is one of the world’s leading manufacturers of sensors, safety systems and automatic identification products for industrial applications. With nearly 450 patents, SICK continues to lead the industry in new product innovations. The diversity of its product line allows SICK to offer solutions at every phase of production in the logistics, automotive, packaging, electronics, food and beverage, and material handling markets. SICK was founded in 1946 and has operations or representation in 65 countries worldwide.

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