Phoenix Contact and students celebrate National Engineers Week with Mars rover simulation project.
- by Alan Lusty
Seeking to help fix societal issues around youth skills development in the STEM sector, leading engineering business adi Group marks 2021 with the five-year anniversary of its unique pre apprenticeship scheme.
Monolith AI announces partnership with Siemens Digital Industries Software. Partnership to further accelerate design exploration through simulation, test and AI technologies.
Rand Worldwide, Inc., the parent Company of IMAGINiT Technologies, Rand SIM, ASCENT and Rand 3D, announced that its Chief Operating Officer, Bill Zavadil, has been promoted to the role of president effective Feb. 1, 2021.
After decades of designing and building industry-leading industrial polyethylene chemical storage tanks from their flagship manufacturing facility in Corona, California, Peabody Engineering & Supply, Inc. is ready to start growing again—on the east coast.
Samsung Foundry Certifies Analog FastSPICE Platform from Siemens for Early Design Starts on 3nm GAA Process Technology
Siemens today announced that its industry-leading tools for the verification of analog/mixed-signal (AMS) circuits are now qualified for early design starts on Samsung Foundry’s new 3nm Gate All Around (GAA) process technology.
- by Scott Heide
Only with a good marriage of engineering and sales automation can ETO (Engineer to Order) manufacturers provide rapid responses and compelling quotes to customers; quotes include custom documents, 2D drawings, 3D models, renderings, and more.
Purdue University’s Polytechnic Institute (Purdue Polytechnic) is receiving support from major technology companies for the college’s Smart Manufacturing program and facilities.
Merger expands virtual prototyping and advanced engineering simulation capabilities of inflow technology subsidiary.
- by Matthew Dyson
Smart buildings promise automated control of the buildings' operations, along with integrated technology for human-machine interactions. Such functionality requires multiple sensors, to which printed/flexible electronics are very well suited due to their low weight and thin-film form factor.
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