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Design & Simulation Software

Siemens announces Simcenter 3D software with enhancements for low- and high-frequency electromagnetic solutions
July 10, 2019

Siemens announces Simcenter 3D software with enhancements for low- and high-frequency electromagnetic solutions

By including electromagnetic simulation into Simcenter 3D, engineers can take advantage of the integrated environment to perform electromagnetic simulation and streamline multiphysics workflows between electromagnetic and other physical simulations.

Abaco Systems introduces VP430 Development Kit
June 18, 2019

Abaco Systems introduces VP430 Development Kit

The VP430 is a 3U VPX COTS solution featuring the Xilinx ZU27DR RF system-on-chip (RFSoC) technology. It is also a dense analog FPGA DSP board, with eight ADC and DACsynchronized channels, and features the ability to synchronize multiple boards for even larger system applications.

Measurement Computing Corporation releases MCC 134 thermocouple measurement HAT for Raspberry Pi
June 14, 2019

Measurement Computing Corporation releases MCC 134 thermocouple measurement HAT for Raspberry Pi

The device features four thermocouple (TC) inputs capable of measuring the most popular TC types including J, K, R, S, T, N, E, and B. Each channel type is selectable on a per-channel basis.

Siemens announces Solid Edge 2020 software
June 14, 2019

Siemens announces Solid Edge 2020 software

Solid Edge 2020 provides next generation technologies to enhance collaboration and fully digitalize the design-to-manufacturing process.

Reliable Controls introduces MACH-ProZone (MPZ) version 8 controller
June 13, 2019

Reliable Controls introduces MACH-ProZone (MPZ) version 8 controller

The MACH-ProZone is designed for a range of applications that include small to mid-sized roof top and heat pump applications, and small mechanical room applications.

Basler announces BCON for MIPI interface
June 12, 2019

Basler announces BCON for MIPI interface

The BCON for MIPI interface combines the MIPI technology with standards and the features of the Machine Vision world. This approach utilizes the Qualcomm Spectra ISP.

Honeywell introduces Experion PKS Highly Integrated Virtual Environment (HIVE)
June 10, 2019

Honeywell introduces Experion PKS Highly Integrated Virtual Environment (HIVE)

Experion PKS HIVE uses Honeywell’s LEAP project execution principles, software and networking to unchain control applications from physical equipment, and controllers from physical IO.

Webalo announces release of Webalo 5.1
June 04, 2019

Webalo announces release of Webalo 5.1

Webalo 5.1 brings functionality to support frontline workers in energy, food and beverage, manufacturing, mining, oil & gas, transportation and other industrial segments

Arduino releases Arduino SIM SIM-only service for IoT devices
May 21, 2019

Arduino releases Arduino SIM SIM-only service for IoT devices

Arduino SIM aims to provide a path to cellular IoT device development in an environment familiar to millions. The cellular service, provided by Arm Pelion Connectivity Management, means a single physical Arduino SIM can be used in over 100 countries worldwide with one data plan.

Interface Concept announces IC-FEP-VPX3f board
May 17, 2019

Interface Concept announces IC-FEP-VPX3f board

The IC-FEP-VPX3f board is a VITA 66.5 compliant 3U VPX Xilinx Kintex UltraScale FPGA board. The VITA 66.5 standard enhances VPX capabilities by offering fiber optic interfaces on the board’s backplane connectors: the IC-FEP-VPX3f comes with 12 such full-duplex optical lanes.

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Bentley Systems announces OpenBuildings Station Designer
May 15, 2019

Bentley Systems announces OpenBuildings Station Designer

OpenBuildings Station Designer is a multidisciplinary application for the design, analysis, visualization, and simulation of new or operating rail, metro or other transit stations.

MDT Software releases AutoSave v7.0 source code control software
May 15, 2019

MDT Software releases AutoSave v7.0 source code control software

AutoSave v7.0 includes the release of the web-based AutoSave Portal, Online Training offerings and other new features such as a flexible Scheduled Compare tool and expanded language capabilities.

Siemens introduces PAVE360 pre-silicon autonomous validation environment
May 15, 2019

Siemens introduces PAVE360 pre-silicon autonomous validation environment

AVE360 pre-silicon autonomous validation environment is a program established to enable and accelerate the development of autonomous vehicle platforms. PAVE360 provides an environment for multi-supplier collaboration across the automotive ecosystem for the development of automotive chips.

Brainboxes releases BB-400 NeuronEdge Controller
May 09, 2019

Brainboxes releases BB-400 NeuronEdge Controller

The BB-400 NeuronEdge combines Brainboxes IO and serial connectivity with a range of network connections to allow data to flow to the application of choice. The design uses a Raspberry Pi Compute module and an Arduino to provide edge processing.

ARC Informatique announced the release of PcVue version 12
April 24, 2019

ARC Informatique announced the release of PcVue version 12

This version comes with an IoT LoRaWAN driver to aggregate data from connected things, and a Universal Data Connector for interoperability.

Beckhoff Automation introduces the C6032 Industrial PC (IPC)
April 18, 2019

Beckhoff Automation introduces the C6032 Industrial PC (IPC)

With dimensions of 129 x 133 x 104 mm, the C6032 IPC is designed to enhance the scalability of the PC-based controller portfolio from Beckhoff.

Siemens announces availability of Mendix for MindSphere
April 17, 2019

Siemens announces availability of Mendix for MindSphere

The Mendix application platform’s AI-assisted, visual development model expands the pool of talent available to develop IoT applications. Business developers, domain engineers, and plant operations staff — in addition to professional developers — can build IoT solutions without the need for coding.

FLIR Systems introduces FLIR Research Studio thermal imaging software
April 10, 2019

FLIR Systems introduces FLIR Research Studio thermal imaging software

In combination with a FLIR thermal imaging camera for science applications, FLIR Research Studio provides a solution for R&D teams.

Abaco introduces Obox R&D evaluation platform
March 26, 2019

Abaco introduces Obox R&D evaluation platform

A rugged (-40°C to + 71°C) enclosure houses customer-specified combinations of Abaco’s 3U VPX single board computers, FPGA/DSP subsystems and AI/GPGPU-enabled platforms to deliver up to 14 TeraFLOPS of computing power, together with high speed network switches.

Basler releases Basler boost series camera with CoaXPress 2.0 interface
March 20, 2019

Basler releases Basler boost series camera with CoaXPress 2.0 interface

The camera is designed to deliver high resolutions and high frame rates with a cable length of up to 40 m. Basler also offers a combination of camera and matching interface card from a single source in form of the Basler boost bundle.