MTConnect Institute announces OPC Unified Architecture for MTConnect Companion Specification Release Candidate (RC) 2.0.4 | Automation.com

MTConnect Institute announces OPC Unified Architecture for MTConnect Companion Specification Release Candidate (RC) 2.0.4

MTConnect Institute announces  OPC Unified Architecture for MTConnect Companion Specification Release Candidate (RC) 2.0.4

December 11 2018 – "OPC Unified Architecture for MTConnect Companion Specification Release Candidate (RC) 2.0.4" is now available. The document is an overhaul and rewrite of RC 1.0.2 (2013) that incorporates current features and functions of MTConnect and OPC UA.

Manufacturers demand streamlined, secure data. The MTConnect Institute and has developed a semantic data model for Manufacturing Technology and has modeled that data into an OPC UA companion specification leveraging secure information integration from the embedded world to the cloud. Previously disconnected, disparate applications and devices can now be interconnected to take advantage of standardized data and information for manufacturing applications. This allows manufacturing applications to truly optimize production with significant increases in operational efficiency.

RC 2.0.4 was developed in a joint working group of the OPC Foundation and MTConnect Institute based on current OPC Foundation companion specification templates. While it is a complete and fully functional spec, a series of test implementations are planned for verification and additional input from prospective implementers is welcome.  Release candidate implementers should join the working group (https://www.mtconnect.org/working-groups) to log bugs and issues, provide input to the final spec, and help move to a formal release under OPC Foundation procedures.


About MTConnect

MTConnect is an open, royalty-free standard that provides a semantic vocabulary for manufacturing devices. It works to reduce the cost and complexity of system integration and fosters interoperability for the factory.
 

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