DFI introduces low power embedded boards | Automation.com

DFI introduces low power embedded boards

January 072016
DFI  introduces low power embedded boards

January 7, 2016 -  DFI announced four embedded boards, including two Mini-ITX motherboards, one single board computer (SBC), and one 2.5” Pico-ITX powered by the latest Intel Pentium/Celeron processor N3000 family. Based on this low power platform, designed for mid to entry level systems, these boards deliver enhanced graphics capabilities and premium performance averaging just 6 watts TDP.

BW171 and BW173 Mini-ITX motherboards are designed with only 25mm in height and include a variety of I/O connectivity. In addition, the optional power connectors (including right angle connector, vertical type connector, and DC-in jack) are available for customers to easily assemble their all-in-one thin systems. The two thin Mini-ITX also support three independent displays, VGA+LVDS+DP++, with Intel HD graphics to deliver up to 3840x2160 high resolution.

The BW051 is the Pico-ITX form factor measuring at 100mm x 72mm with DFI’s SBC platform design, and it features a small-sized mainboard to easily integrate into various space-limited applications with substantial I/O requirements. Additionally, DFI’s new embedded SBC boards, BW551 and BW051, are equipped with proprietary optional heat spreader with low thermal dissipation to satisfy fanless and mobile system integrations. These embedded boards also offer flexibility with multiple expansion interfaces: PCIe x1 slot, mSATA slot, Mini PCIe slot, and SIM card socket to expand and fulfill diversified computing applications.

DFI’s embedded boards are specially designed by industrial-grade components with 100% Japanese CAP and polymer capacitors to ensure long product lifecycle and MTBF. Furthermore, the 15k high ESD protection on all I/O ports prevents any damages to the internal components from static electricity and ensures system’s robustness in harsh environments. DFI also provides a high-qualified testing environment in thermal cycle testing, thermal profile temperature, and capacitor temperature for all heat-generated parts. With these features, the four new board-level products comprehensively satisfy most of the embedded smart solutions.

About DFI
Established in 1981, DFI is a leading supplier of high-performance computing technology worldwide. With more than 34 years of experience, DFI focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical diagnostic & imaging, ATM/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications.

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