Hectronic announces H6066 COM Express module | Automation.com

Hectronic announces H6066 COM Express module

September 032014
Hectronic announces H6066 COM Express module

September 3, 2014 - Hectronic announced H6066 COM Express module based on the second generation AMD Embedded G-Series SOC with quad-core processors. The board targets applications in harsh environments and is specified for an industrial operating temperature range (-40°C to +85°C). The form factor is COM Express pinout type 6 and the board size is 95mm x 95mm.

H6066 is designed to withstand challenging conditions involving for instance vibration, dust, damp and cold/warm surrounding temperatures. Components specified for extended operating temperatures are used and memories are soldered to the board. Soldered FLASH SSD storage and conformal coating are optional. The board has wide input voltage and is powered by -4.75V to +20V. H6066 targets applications within Defense, Transportation, Maritime, Medical and Industrial Automation. The graphics engine integrated in the processor is AMD Radeon HD 8000E which can be used for general purpose GPU computing (GPGPU) by taking advantage of AMD's Open CL support. ”The combination of powerful quad-core processors, excellent graphics and the possibility to develop rugged systems for harsh environments are the reasons why H6066 will be interesting to use in many applications,” says Robert Helenius, Product Manager at Hectronic.

H6066 has a rich set of I/O interfaces including four PCI Express ports, two USB 3.0, eight USB 2.0 and three SATA ports. Dual independent displays can be connected to dual 24-bit LVDS and one of the digital display interfaces DVl, HDMI, DisplayPort or VGA. The board supports up to 4GB onboard soldered DDRIII DRAM, as well as an onboard soldered BGA SATA Flash SSD of up to 32GB. There are two versions of H6066. The first one is based on the GX-411GA processor (15 Watt) specified for an operating temperature range of -40°C to +85°C. The second version is based on the GX-420CA processor (25 Watt) for use in temperatures from 0°C to +60°C.

Hectronic has developed a BIOS for the module based on the Phoenix SecureCore UEFI BIOS. Board support packages for XP Embedded, Windows Embedded Standard 7, Windows Embedded 8 and Linux are provided.

Early access samples are available to key OEM customers.

Technical support is provided directly from Hectronic's development team in Uppsala, near Stockholm, Sweden.

 Hectronic is an AMD Embedded Solution partner.