Products for Discrete Manufacturing & Machine Control
STMicroelectronics Drives G3-PLC Hybrid Connectivity into Smart Devices with ST8500 Development Ecosystem
To accelerate G3-PLC Hybrid connectivity in smart-grid and IoT devices, STMicroelectronics has revealed a development ecosystem for its ST8500 programmable power-line communication (PLC) modem chipset.
ADVANCED Motion Controls® has just added three PCB mount servo drives with CANopen® communication and Extended Environment capabilities to the FlexPro® drive family.
Microchip Delivers Accuracy and Energy-efficiency of Current Monitoring in High-temperature Automotive Applications
New high-side current sense amplifier offers the industry’s lowest offset for AEC-Q100 Grade 0 qualified devices, enabling a more accurate and energy efficient current measurement solution for those applications exposed to extreme temperatures.
With the TRK38, TWK introduces an ultra-compact single-turn magnetic encoder developed with safetyoriented applications in mind.
- Curtiss Wright Controls, Inc.
Curtiss-Wright’s Actuation Division announced the release of its new ASSIGN™ motor program for Exlar® FTX and FTP Series actuators.
LK Metrology has now expanded its FREEDOM arm range of 3D articulating arm metrology systems, or portable measuring arms, with the launch of five ultra-accuracy models in both 6-axis and 7-axis variants.
- Bosch Rexroth
Ball rail systems and ball screw assemblies with longer lubrication intervals reduce operating costs and protect the environment.
STMicroelectronics' Complete Energy-Meter Evaluation Board that Combines Low-cost Sensors and Robust Galvanic Isolation
Accelerates time to market leveraging ST’s long expertise in utility and industrial metering applications.
- Pro-face America
Pro-face America announces the release of the new PS6000 Modular IPC Series.
Siemens and ASE Introduce Enablement Technologies for Next-generation High Density Advanced Package Designs
The new high-density advanced packaging (HDAP) enablement solutions stem from ASE’s participation in the Siemens OSAT Alliance–a program designed to drive faster adoption of new HDAP technologies like 2.5D, 3D IC and Fan-Out wafer-level packaging (FOWLP) for next-generation IC designs. ASE is a leading provider of independent semiconductor assembling and test manufacturing services.