Based on photoelectric Micromote technology, it features an LED sensor in a sensor head measuring 2.4 x 1.5 x 7 mm. Especially designed for use with thin end effectors, it features a controlled and focused light spot, allowing it to detect wafers a few μm thick.
January 21, 2020 — Balluff’s wafer mapping sensor, BOH00EZ, utilizes a photoelectric sensor for detection of semiconductor wafers and slotting errors in FOUPS – front opening unified pods. Especially designed for use with thin end effectors, it features a controlled and focused light spot, allowing it to detect wafers a few μm thick.
Based on photoelectric Micromote technology, it features an LED sensor in a sensor head measuring 2.4 x 1.5 x 7 mm.
In addition to wafer mapping, this sensor delivers capabilities that can be used for a variety of applications that require through beam sensors in a small area, such as Life Science and Food and Beverage applications.
