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EC70A-SU Fanless Embedded System

By: DFI Inc.
28 June, 2017
EC70A-SU Fanless Embedded System
EC70A-SU Fanless Embedded System
The EC70A-SU, which is capable of extensive I/O capabilities and increased computing performance, takes full advantage of 6th Gen Intel® Core i7/i5/i3 U-series processors delivering only 15 watts TDP.

The EC70A-SU, which is capable of extensive I/O capabilities and increased computing performance, takes full advantage of 6th Gen Intel® Core™ i7/i5/i3 U-series processors delivering only 15 watts TDP. This new fanless system has an upgraded onboard DDR4 memory that enables accelerated exploration of complex data. In addition, the fanless thermal design provides sufficient heat dissipation for space-limited environments. Due to the advanced I/O expandability (2 Intel GbE, 4 COM, 4 USB 3.0, 1 VGA, and 1 HDMI), it makes the system suitable for a variety of embedded applications in smart factory, IoT networks, digital signage, digital healthcare, etc.

More information: http://www.dfi.com/products/product.html? productId=10064

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