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Hilscher's Cyber-Secure Plug-In Communication Module Simplifies Industrial Device Integration

Source: Hilscher
05 August, 2026
Feature Image for Hilscher's Cyber-Secure Plug-In Communication Module Simplifies Industrial Device Integration
Hilscher has introduced the NRP H90ICF8D8, a cyber-secure plug-in communication module designed to simplify the integration of industrial networking into compact field devices.

Aug. 5, 2026 — Hilscher has introduced the NRP H90ICF8D8, a cyber-secure plug-in communication module designed to simplify the integration of industrial networking into compact field devices. Based on the company's proven netX 90 multiprotocol communication controller, the module enables device manufacturers to implement secure Industrial Ethernet, fieldbus and IIoT connectivity while reducing development effort and hardware complexity.

The module is intended for compact industrial devices such as drives, measurement systems, welding equipment, weighing systems and laser devices. Its plug-in chip-carrier architecture allows engineers to integrate communication functionality without redesigning the entire electronics platform. The removable design also reduces manufacturing risk by simplifying assembly, replacement and servicing.

A key advantage is support for multiple industrial communication protocols on a single hardware platform. Engineers can deploy one hardware design across applications requiring protocols such as PROFINET, EtherNet/IP, EtherCAT, PROFIBUS, CANopen, DeviceNet, CC-Link IE Field Basic and additional IIoT protocols including MQTT and OPC UA. This approach reduces hardware variants, streamlines maintenance and helps manufacturers standardize product platforms.

The NRP H90ICF8D8 has been developed with cybersecurity requirements in mind and is positioned as a CRA-compliant communication module. Combined with the security features of the netX 90 platform, it supports the development of industrial devices designed to meet evolving cybersecurity expectations while maintaining long-term availability.

The compact module measures 18 × 45 × 9.7 mm and connects through a 52-pin SMT connector with screw fastening for reliable mechanical attachment. Communication with the host processor is provided through a serial dual-port memory interface (SPI), enabling straightforward integration into compact hardware designs.

The module is suitable for future-ready industrial devices supporting applications such as condition monitoring and predictive maintenance while allowing manufacturers to shorten development cycles and reduce time-to-market through a standardized communication platform.

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