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DFI held a factory tour to introduce the manufacturing process of industrial motherboards and embedded system for the Japanese students from Special Needs Education School for the Deaf, University of Tsukuba, in December.

With the new Modbus content and metadata extraction functionality, vendors of security products, such as firewalls or gateways, gain granular visibility and control of the Modbus protocol communication

With its TIM 1531 IRC communication module, Siemens is extending its telecontrol product spectrum to include modular RTUs (Remote Terminal Units) on the basis of the Advanced Controller Simatic S7-1500

• Intel® Atom™ Processor E3900 Series • Mini-ITX • 2 DDR3L 1867MHz SODIMM up to 16GB • Three independent displays: (VGA/DP++) + (HDMI/DP++) + (LVDS/eDP) • DP++ resolution supports up to 4096x2304 @ 60Hz • Multiple expansion: 1 M.2, 1 PCIe x1, 1 Mini PCIe • LPC EXT-RS232/485 module extends additional 4 COM ports • Rich I/O: 2 Intel GbE, 6 COM, 4 USB 3.0, 5 USB 2.0

Fluke Process Instruments has equipped the data logger with a polycarbonate casing that withstands harsh treatment and heat up to 100 °C without distortion and without harm to the electronics.

This next generation offering includes an interface with improved visualization, smarter navigation and is integrated with the Schneider Electric Industrial Software portfolio –extending new and existing solutions with capabilities that digitally link the Engineering, Operations and Asset Performance aspects of the industrial value chain.

Wireless technology has gained rapid acceptance in many industrial sectors because of its cost effectiveness, reliability, fast deployment, and flexibility.

RF switches are microwave devices that route high frequency signals through transmission paths and can be used for diverse range of applications including WLAN, Mobile Communications, Wireless Security, Wireless Home Automation, Digital TV and many other RF products.

Featuring Konrad’s test technologies and expertise, this manufacturing inline test system integrates with board handling equipment, including conveyors and short stations and is suitable for straightforward integration into production or testing lines.

The housing, connectors, lens barrels and cables all meet the requirements for protection class IP65/67 and protect cameras from dirt, dust, water splashes or cleaning agents as well as accidental shifting of the optics.

GE Healthcare has reduced the size of its repair cell stations at the Repair Operations Center by 40%, much of which is due to the integration of the OTTO self-driving vehicles.

DFI’s upcoming boards with 7th Generation Intel® Core™ processor (code name Kaby Lake) bring customers overall enhanced experiences such as low-power with a TDP of 15W, increased CPU performance by 5%, visual enhancement with lower power consumption, and faster speed shift technology.

Since studies have shown that ticketing experience plays a vital part in customers’ perception of transit service quality, Korea Railroad Corporation (Korail), a national operator of railway lines, recognized the need to deliver efficient passenger services by upgrading the ticket vending machines at major stations.

The combination of the 6th generation Intel® Core™ processor and DFI’s high quality production ensures that the new SBC is equipped with high speed CPU performance, powerful 4K-capable graphics, DDR4, and Windows 10 support.

As a national operator of railway lines, Korail recognized the need to improve its services due to consumer demands and the modernization of mass transit. Through collaboration with other hardware suppliers and system integrators, DFI contributed to the successful upgrade of the TVMs at major subway stations in Seoul.

DFI has launched new industrial motherboards powered by the latest Intel® Atom™ processor E3900 family (code name Apollo Lake).

DFI announced that it has been awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) by IPC’s Validation Services Program under the on-site audit guidance.

Enact helps users process critical quality data that today’s modern manufacturing operations require. Advances in mobile and cloud computing, automation, and the IIoT enable Enact to aggregate data from disparate sources and input methods, uncover strategic information, and prioritize enterprise-wide quality activities.

When used in conjunction with the CAD environment enabled by FactoryLogix, the output data from CyberOptics’ AOI and SPI machines allows for a digital view of the collected defect data that extends down to the pin level.

The ability to function in extreme temperatures from -40° C to +85 makes the Ruggedcom RX 1400 a suitable choice for MindSphere data acquisition in industrial applications such as electric power, transportation, and oil & gas.