July 11, 2016 - Machine Vision Products (MVP) announced it would be demonstrating their inspection toolbox on the MVP 850 Platform for Microelectronics and Packaging at the Semicon West 2016 exhibition. Applications will include Lead Frame inspection for die placement, epoxy and wire bond as well as demonstrating new surface inspection capabilities.
MVP Microelectronics AOI platforms have been designed to for accurate inspection in multiple applications. With resolution and repeatability a critical factor, the AOI platforms can be configured to provide a 1um pixel resolution size.
MVP Microelectronics AOI platforms can be configured for Lot Solutions including Magazine Lifters/Indexers, Jedec Trays, Waffle Packs, and Auer Boats. MVP’s inline solutions allow for both single and dual lane processing, strip handling and in-line wafer handing. MVP also works to deliver custom handling solutions for specialized inspection applications.
MVP Microelectronics AOI Applications
Lead Frame inspection including:
- Die Placement Metrology
- Wire Bond
- Epoxy Spread and Bridging
- Lead Frame Integrity
BGA inspection including:
- 2D and 3D high-resolution imaging
- Ball Diameter, Shape, Offsets and Damage;
- Coplanarity and Height Measurements
Metrology inspection including:
- Die Alignment Metrology on the substrate
- Edge, FM and Surface
- Flux and Paste
Dice Wafer Inspection including:
- Die Metrology
- Die Surface and Edge Chips
