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Author Profile

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Manish Kumar

From day dreaming designs at IIT, Delhi lecture halls to building his own furniture, this avid woodwork artist knows design like the back of his hand. In his more than two decades at SOLIDWORKS, Manish Kumar has led early development of translators, surfacing, modelling, sketcher, assembly, weldments, sheet metal, drawings and more.

In his current role as CEO, Manish spearheads the synergy between R&D and the brand’s vibrant community of users and helps in accelerating the adoption of the expanding SOLIDWORKS portfolio. As the Vice President of SOLIDWORKS R&D, he has played a key role in the development of SOLIDWORKS product and technology strategies

59,091 Results Found
  • Thumbnail for This is what’s truly essential for embedded solutions - DFI Fanless and Small Box PC

    This is what’s truly essential for embedded solutions - DFI Fanless and Small Box PC

    As more and more balance is required among high performance, small size, and ability to be fanless in the embedded markets, DFI is glad to introduce to you a brand-new option: EC70A-SU/EC70B-SU industrial box PC powered by 6th Generation Intel® Core™ i7/i5/i3 processor (code name: Skylake).
    27 April, 2017 | 1 minute
  • Thumbnail for Parker Hannifin introduces Voice of the Machine IoT platform

    Parker Hannifin introduces Voice of the Machine IoT platform

    The Voice of the Machine IoT platform is an open, interoperable and scalable ecosystem of connected products and services. Every connected product uses the same repository of digital services with an exchange-based platform architecture, designed by software experts at Exosite.
    27 April, 2017
  • Thumbnail for Fluke announces release of DATAPAQ EasyTrack 3 system

    Fluke announces release of DATAPAQ EasyTrack 3 system

    Fluke Process Instruments has equipped the data logger with a polycarbonate casing that withstands harsh treatment and heat up to 100 °C without distortion and without harm to the electronics.
    27 April, 2017
  • Thumbnail for Schneider Electric releases System Platform 2017

    Schneider Electric releases System Platform 2017

    This next generation offering includes an interface with improved visualization, smarter navigation and is integrated with the Schneider Electric Industrial Software portfolio –extending new and existing solutions with capabilities that digitally link the Engineering, Operations and Asset Performance aspects of the industrial value chain.
    27 April, 2017
  • Thumbnail for DFI announces AL171/AL173 Mini-ITX industrial motherboards with Intel Atom E3900 Processor

    DFI announces AL171/AL173 Mini-ITX industrial motherboards with Intel Atom E3900 Processor

    • Intel® Atom™ Processor E3900 Series • Mini-ITX • 2 DDR3L 1867MHz SODIMM up to 16GB • Three independent displays: (VGA/DP++) + (HDMI/DP++) + (LVDS/eDP) • DP++ resolution supports up to 4096x2304 @ 60Hz • Multiple expansion: 1 M.2, 1 PCIe x1, 1 Mini PCIe • LPC EXT-RS232/485 module extends additional 4 COM ports • Rich I/O: 2 Intel GbE, 6 COM, 4 USB 3.0, 5 USB 2.0
    27 April, 2017
  • Thumbnail for Siemens introduces TIM 1531 IRC communication module

    Siemens introduces TIM 1531 IRC communication module

    With its TIM 1531 IRC communication module, Siemens is extending its telecontrol product spectrum to include modular RTUs (Remote Terminal Units) on the basis of the Advanced Controller Simatic S7-1500
    27 April, 2017
  • Thumbnail for DFI Inc. Earns Certification as Qualified Manufacturer to IPC QML

    DFI Inc. Earns Certification as Qualified Manufacturer to IPC QML

    DFI announced that it has been awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) by IPC’s Validation Services Program under the on-site audit guidance.
    26 April, 2017 | 2 minutes
  • Thumbnail for What's More Thrilling - DFI's New Products with 7th Gen Intel Core Processors

    What's More Thrilling - DFI's New Products with 7th Gen Intel Core Processors

    DFI’s upcoming boards with 7th Generation Intel® Core™ processor (code name Kaby Lake) bring customers overall enhanced experiences such as low-power with a TDP of 15W, increased CPU performance by 5%, visual enhancement with lower power consumption, and faster speed shift technology.
    26 April, 2017 | 1 minutes
  • Thumbnail for Otto Motors helps GE enable lean manufacturing of medical equipment

    Otto Motors helps GE enable lean manufacturing of medical equipment

    GE Healthcare has reduced the size of its repair cell stations at the Repair Operations Center by 40%, much of which is due to the integration of the OTTO self-driving vehicles.
    26 April, 2017 | 2 minutes
  • Thumbnail for Improve Mass Transit Service with DFI’s COM Express

    Improve Mass Transit Service with DFI’s COM Express

    As a national operator of railway lines, Korail recognized the need to improve its services due to consumer demands and the modernization of mass transit. Through collaboration with other hardware suppliers and system integrators, DFI contributed to the successful upgrade of the TVMs at major subway stations in Seoul.
    26 April, 2017 | 2 minutes
  • Thumbnail for Korail Successfully Increased the Efficiency of Ticket Machines by Importing DFI’s COM Express

    Korail Successfully Increased the Efficiency of Ticket Machines by Importing DFI’s COM Express

    Since studies have shown that ticketing experience plays a vital part in customers’ perception of transit service quality, Korea Railroad Corporation (Korail), a national operator of railway lines, recognized the need to deliver efficient passenger services by upgrading the ticket vending machines at major stations.
    26 April, 2017 | 1 minute
  • Thumbnail for Wide-Temp Rugged Embedded Boards Perform 24/7 in Extreme Environments

    Wide-Temp Rugged Embedded Boards Perform 24/7 in Extreme Environments

    DFI has launched new industrial motherboards powered by the latest Intel® Atom™ processor E3900 family (code name Apollo Lake).
    26 April, 2017 | 1 minute
  • Thumbnail for Can DFI propel customers to the next level with the new SBC?

    Can DFI propel customers to the next level with the new SBC?

    The combination of the 6th generation Intel® Core™ processor and DFI’s high quality production ensures that the new SBC is equipped with high speed CPU performance, powerful 4K-capable graphics, DDR4, and Windows 10 support.
    26 April, 2017 | 2 minutes
  • Thumbnail for What Is the Next Generation of Process Automation Wireless Technology?

    What Is the Next Generation of Process Automation Wireless Technology?

    Wireless technology has gained rapid acceptance in many industrial sectors because of its cost effectiveness, reliability, fast deployment, and flexibility.
    By: Contributing Authors
    26 April, 2017 | 6 minutes
  • Thumbnail for CEL releases CEL CG2409 family of RF switches

    CEL releases CEL CG2409 family of RF switches

    RF switches are microwave devices that route high frequency signals through transmission paths and can be used for diverse range of applications including WLAN, Mobile Communications, Wireless Security, Wireless Home Automation, Digital TV and many other RF products.
    26 April, 2017
  • Thumbnail for Konrad introduces Leon Inline Tiny manufacturing inline test system

    Konrad introduces Leon Inline Tiny manufacturing inline test system

    Featuring Konrad’s test technologies and expertise, this manufacturing inline test system integrates with board handling equipment, including conveyors and short stations and is suitable for straightforward integration into production or testing lines.
    26 April, 2017
  • Thumbnail for IDS announces UI-5260FA and UI-5280FA models of industrial cameras

    IDS announces UI-5260FA and UI-5280FA models of industrial cameras

    The housing, connectors, lens barrels and cables all meet the requirements for protection class IP65/67 and protect cameras from dirt, dust, water splashes or cleaning agents as well as accidental shifting of the optics.
    26 April, 2017
  • InfinityQS releases Enact quality intelligence platform

    Enact helps users process critical quality data that today’s modern manufacturing operations require. Advances in mobile and cloud computing, automation, and the IIoT enable Enact to aggregate data from disparate sources and input methods, uncover strategic information, and prioritize enterprise-wide quality activities.
    26 April, 2017
  • Thumbnail for Aegis announces compatibility with CyberOptics SPI and AOI machines

    Aegis announces compatibility with CyberOptics SPI and AOI machines

    When used in conjunction with the CAD environment enabled by FactoryLogix, the output data from CyberOptics’ AOI and SPI machines allows for a digital view of the collected defect data that extends down to the pin level.
    26 April, 2017
  • Thumbnail for Siemens announces Ruggedcom RX1400 router with MindConnect

    Siemens announces Ruggedcom RX1400 router with MindConnect

    The ability to function in extreme temperatures from -40° C to +85 makes the Ruggedcom RX 1400 a suitable choice for MindSphere data acquisition in industrial applications such as electric power, transportation, and oil & gas.
    26 April, 2017
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