October 31, 2019 - StratEdge Corporation , a designer, producer, and assembler of semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, announced its assembly services for attaching gallium nitride (GaN) and other devices using gold-tin (AuSn) and gold-silicon (AuSi) onto copper-molybdenum-copper (CMC) tabs. StratEdge uses an automated system in a cleanroom environment to perform eutectic AuSn die attach of compound semiconductor devices that have a backside gold surface finish. The bonder has micron placement accuracy. Solder preforms are matched to the size of the die to reduce solder bond line thickness to less than 6µm, maximizing power output for GaN devices, lowering junction temperatures, and increasing device reliability.
For silicon devices, a AuSi eutectic die attach method is used to create a solder joint with thermal dissipation. StratEdge will be exhibiting at the 2019 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) in Booth 10. BCICTS is being held at the Loews Vanderbilt Hotel, Nashville, TN, from November 3-6.