Nov. 10, 2020 - Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company and global leader in machine vision, is pleased to announce its new Genie Nano-CXP 67M and 37M cameras based on the Teledyne e2v Emerald color and monochrome sensors. The newest Genie Nano models are easy-to-use and feature a CoaXPress interface. The cameras are engineered for industrial imaging applications requiring high-speed data transfer, such as industrial automation, electronics manufacturing, packaging inspection, semiconductor inspection, PCB-AOI (Automated Optical Inspection) and general machine vision.
Designed for a wider range of operating temperatures (from -20°C to 60°C housing temperature), the cameras can be integrated in harsh environments in imaging systems and increases their long-term reliability. “With the addition of these higher resolution Genie Nano models, our camera portfolio spans resolutions from 16M to 67M with a CoaXPress 6Gbps interface to deliver the maximum throughput from leading-edge, high-resolution CMOS image sensors,” said Manny Romero, Senior Product Manager at Teledyne DALSA. The Genie Nano-CXP 67M and 37M cameras are fully integrated with Teledyne DALSA’s Xtium™-CXP and Xtium2™-CXP series high performance frame grabbers, providing both convenience and guaranteed compatibility from a single vendor.
The Xtium series frame grabbers are also supported by Sapera LT SDK, an image acquisition and control software development toolkit (SDK) that includes Trigger-to-Image (T2IR) framework for maximum reliability of the image acquisition system. Key features:
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Four new models in 67.1 and 37.7-million-pixel monochrome and color versions
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Wider range of operating temperatures of -20°C to 60°C (Housing Temperature) increasing camera long-term reliability in harsh environment imaging systems
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Series supports advanced high-performance camera features in a compact form factor for easy integration
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All-metal body with 3-year warranty
For more information about the Genie Nano-CXP 67M and 37M camera models visit the website .
