March 20, 2019 -YXLON International, a division of the Swiss Comet Group, is launching a range of X-ray inspection systems dedicated to the Semicon industry. These systems offer automated 2D and 3D inspection of bumps and filled vias to locate, identify and measure failures, including non-wetted bumps, voiding and misalignments. The range is being introduced during the Semicon China exhibition in Shanghai, March 20-22, 2019, booth #2439 – with a live presentation of the YXLON FF70 CL.
The FF70 CL and FF65 CL series are fully automated analysis systems offering resolution and magnification for the smallest semiconductor defect detection. The range of inspection systems provides automated analysis of TSVs, C4 bumps, 3D packages and MEMS at wafer, strip or component level with maximum throughput. Lastly the FF65 IL with its integrated loader is designed to meet the needs of volume manufacturing. They were developed under collaboration with Nagoya Electric Works.
