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Smooth. Seamless. Smart. Meet GOT3000.
Faster startup, clearer visuals, built in OPC UA and VPN. GOT3000 HMIs help reduce downtime and simplify smart factory integration. -
2026 State of Industrial AI Report for Manufacturing
Cisco's 2026 State of Industrial AI Report, surveying 350+ manufacturing professionals across 19 countries, explores how firms adopt AI, secure networks and scale operations.
243 Products
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Delta Cotton Swabs’ Automatic Inspection and Packaging Solution Enhances Product Quality
Delta recently built a cotton swabs’ automatic inspection and packaging solution for a packaging partner working with a cotton swab manufacturer. -
FuTech Solution's Innovative Recycling Machine will Revolutionize US Food Industry
Rejected goods have always been an issue for the food industry around the world. They not only have a negative impact on sales but also generate additional recycling costs and affect ecological balance sheets. FuTech Solution’s unpacking machine "Skinner" solves this problem by mechanically removing faulty products/packaging from their packaging. This allows for fully automated production of reworks so that companies can work more efficiently and more sustainably. -
STXI Motion's Compact Microcontroller Delivers Multi-Axis Motion Control and Robotic Innovations to Packaging Systems
Developed by Servotronix with an EtherNet/IP interface from STXI Motion, the softMC compact microcontroller enables any major OEM programmable logic controller (PLC) to seamlessly control any motion control component, including robots, drives, and motors, to add innovation and modularity to packaging systems. -
Chatillon CS2 Series Offer Easy, Low-Cost Force Testing
The digital Chatillon CS2 Series of force testers meets these requirements and is an ideal low-cost solution for force testing applications where advanced material testing functionality is not required. -
Siemens and ASE Introduce Enablement Technologies for Next-generation High Density Advanced Package Designs
The new high-density advanced packaging (HDAP) enablement solutions stem from ASE’s participation in the Siemens OSAT Alliance–a program designed to drive faster adoption of new HDAP technologies like 2.5D, 3D IC and Fan-Out wafer-level packaging (FOWLP) for next-generation IC designs. ASE is a leading provider of independent semiconductor assembling and test manufacturing services. -
Rockwell Automation Delivers Reliable Decoding at the Speed You Need
The new Allen-Bradley 48CR Code Reader from Rockwell Automation delivers 1D, 2D and Direct Part Marked (DPM) code reading–including barcodes and QR Codes–in a small package. -
Expand What’s Possible with the Latest Release of PlantPAx DCS
It’s time to get surgical about solutions. -
Harpak-ULMA Brings Augmented Reality to its Packaging Platforms
Embedded AR and pre-developed experiences democratize a disruptive digital technology for packaging operations. -
Designing Solutions For the Edge: Driving Industrial Innovation
In this webinar, we will address the surge in edge computing and uncover how you can drive value by partnering with Dell Technologies OEM Embedded & Edge Solutions -
Reduce Cost, Drive Innovation and Shorten Time to Market with Commercial Hardware Platforms
Download this white paper to learn the tangible benefits and cost savings available to organizations that leverage commercial hardware systems instead of relying on traditional in-house, component-based engineering. -
Leuze introduces DRT 25C dynamic reference diffuse sensor
Leuze's detection expert – the DRT 25C – works to meet the requirements of packaging machines for confectionery and baked goods with reference technology. -
CMC announces CMC Paper-PRO auto-bagging system
Designed to automate the fulfilment of single or multi products in cut-to-size, ready-to-ship paper bags, the system can process both Paper-PRO Kraft cardboard and CMC Paper-PRO bubble paper that offers the same protection as standard polybags or padded mailers. -
Ebook: Transforming Manufacturing with Data and Technology
Download this eBook to learn how to take advantage of Industry 4.0 and deliver industrial edge solutions for your customers. -
Columbia/Okura announces miniPAL mobile palletizer
The latest design showcased at ATX includes two safety mats and two area scanners that detect when people enter the work envelope, allowing the system to meet higher speeds when not in collaborative mode. -
Dematic announces expansion of Dematic Micro-Fulfillment solution for general merchandise and apparel industries
The Dematic Micro-Fulfillment solution can be installed in 12 weeks and in locations as small as 10,000 sq. ft. The design makes it possible to install in the back of existing retail locations, directly supporting online orders for consumers within a specific radius. -
Mitsubishi Electric announces iQ Monozukuri Packaging and iQ Monozukuri Converting tools
The Printing and Converting packages provide a way to create projects using preconfigured cam profile function blocks, sample programs and sample GOT screens. Both products have been released for years in Japan before coming to North and South America. -
Eastey introduces EXS-100 semi-automatic strapping machine
The semi-automatic EXS-100 strapping machine is designed to apply a plastic strap around user’s packages, preventing them from opening during handling and transit. The EXS-100’s bottom seal design is a solution for low to medium volume users that need additional security beyond case taping. -
SOMIC introduces ReadyPack end-of-line case packing system
ReadyPack is a smaller version of SOMIC’s 424 T2 (D) machine and completely different than the larger SOMIC FLEXX III that was introduced a year ago. ReadyPack is also designed with a slower collating speed. -
Universal Robots announces UR16e collaborative robot
The UR16e combines a 35-lb payload capacity with a reach of 900 mm and pose repeatability of +/- 0.05 mm making it suitable for automatingtasks such as heavy-duty material handling, heavy-part handling, palletizing, and machine tending.

















