The MesoSPHERE Plasma System is designed for processing of 3D and wafer-level packaging processes such as fan-in, fan-out, wafer-level, and panel-level -handling wafers up to 450mm and panels up to 480mm. The MesoSPHERE's W3 three-axis symmetrical plasma chamber ensures that all areas of the wafer are treated equally and uniformly.

The Area Profile Scanner 3D offers a combination of stereometry, triangulation and different types of illumination according to the specific application: a random pattern illumination of a multi-line illumination

The AS7265x chipset consists of 3 6-channel sensor devices, each 4.5 x 4.4 x 2.5mm, in land-grid array packages with integrated apertures. The master-slave-slave architecture appears as a single logical device.

All IntelliPICK3D sensors are pre-calibrated, come with an additional automated calibration of both sensor and robot as well as a menu designed to shortenset up times to just a few hours.

Developed for imaging applications that don’t require the higher speed of On Semi’s P1 sensors, the latest P3-based cameras are available in color and monochrome.

Combined with a USB3 Vision interface for plug and play compatibility, the AP-3200T-USB camera can output as much as 3 x 3.2 megapixels at 38.3 frames/second. The USB3 Vision interface allows for a data throughput of 350 MB/s.

EyeVision has been enhanced to support the Intel Real Sense D-400. The 3D command set of the EyeVision 3D software allows users to capture 3D images and process point clouds with the Intel sensor.

The Falcon4 cameras are powered by Teledyne DALSA’s 86 megapixel global shutter CMOS image sensor, which outputs up to 16 full resolution frames per second, and higher with windowing.

With a color display, button operation and image capture/download capability, Camβ is designed for roving inspection tasks, documenting faults and inspecting large or immobile subjects

The software is designed to open up potential in machine building, for instance, through consistent real-time synchronization with other automation tasks or support of track-and-trace solutions.

Provided in a 4.5mm x 4.7mm x 2.5mm land grid array (LGA) apertured package, the AS7264N’s size makes it well suited for luminaires and connected sensor packs

The Ti450 and Ti480 PRO Series of Infrared Cameras are designed for increased thermal sensitivity to capture minute differences. The cameras contain Fluke technology for on-screen clarity to visualize issues in the field.

The optical read device enables customized production and complies with automation requirements in the context of Industry 4.0. It is generally suited for use across many branches of industry, in particular the automotive manufacturing sector and its suppliers, as well as logistics.

The latest addition to the VE Series has the same housing and on-board display as other VE Series Smart Cameras, but provides finer levels of detection and a wider field of view.

Applications include detection of color markings on print marks, labels and packages; color object sorting; verifying color values for painting operations, and spectral measurement of colors in printing processes.

Packaged in a housing that measures just 2.38” (at its widest point) x 2.78”, the sCMOS camera is equipped with passive thermal management for the sensor, reducing dark current without the need for a cooling fan or thermoelectric cooler.

This thermal imager is especially designed for the glass industry and used for real-time temperature monitoring in production, finishing and further processing of glass sheets, bottles, displays and other glass products.

With milli-second response and settling time and dynamic linearity, the new S-335’s are ideal for precision image processing and image stabilization, laser beam steering, materials processing, and lithography.

Spearheaded by IMX273 sensors from the Sony Pregius CMOS family, these Genie Nanos are designed around 1/3” CMOS image sensors that replace Sony’s soon-to-be discontinued CCD sensors.

Teledyne DALSA’s Calibir DX series can be integrated in tight spaces. Cameras and cores support a variety of interfaces, lenses, image processing features and hardware options that serve a wide range of uncooled LWIR thermal imaging applications, including UAV systems for agriculture, construction, defense, mapping and surveying, and oil and gas.