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The new high-density advanced packaging (HDAP) enablement solutions stem from ASE’s participation in the Siemens OSAT Alliance–a program designed to drive faster adoption of new HDAP technologies like 2.5D, 3D IC and Fan-Out wafer-level packaging (FOWLP) for next-generation IC designs. ASE is a leading provider of independent semiconductor assembling and test manufacturing services.

The platform uses existing wiring to deliver a cyber secure building operation system combining the latest technologies with decades of innovation and domain expertise.

The industrial software company announced HighByte Intelligence Hub version 4.1, transforming data services and accelerating DataOps for highly regulated markets.

U.S. adoption of ISO 10218 sets the benchmark for safer, smarter industrial robotics worldwide.

Festo demonstrates a seamless flow of wafers picked, aligned and transported to wet chemistry or a vacuum-based process.

Cincoze has announced the upcoming release of new Intel Alder Lake models in the Rugged Computing–DIAMOND and Display Computing–CRYSTAL product lines.

Interoperability and portability support industrial innovation and reduce obsolescence.

Advanced, real-time, cyber-attack response limits the impact within milliseconds at machine speed, isolating and quarantining the infected production equipment to facilitate faster resumption of normal operations.

OnLogic has unveiled its new Tacton Series of rugged panel PCs and industrial touchscreen displays.

Senseye Predictive Maintenance–a Siemens product–integrates seamlessly and provides maximum value by leveraging your existing investments.

KUKA Robotics is expanding its education portfolio with new robotic cells, simulation software and hands-on training programs designed to assist educators across North America.

Industrials continue to be most targeted sector accounting for 30% of attacks in Q2 and 183 (28%) in June.

Dematic, a global leader in supply chain automation, unveiled its new Solutions Center at its Americas headquarters in Grand Rapids, Michigan.

The 40-hour, self-paced program open to engineering students, career changers and working professionals with no prerequisites.

The advanced process control solution has been used across seven finish mills over one year and across a kiln operation for five years.

Honeywell ThermoRebellionTM uses thermal imaging and artificial intelligence to quickly and accurately detect elevated skin temperatures before boarding flights.

AirSprite Technologies joined as a founding member.

Based on WirelessHART and ISA100, the wireless infrastructure will connect directly to HART devices and require no changes.

Ubisense location solutions will provide Airbus with a real-time view of business operations such as the tracking of components and assembly processes.