April 6, 2020 – Bistel introduced a cloud-based fault detection system which leverages machine learning for trace analysis with the intent to give chipmakers in the semiconductor industry a more comprehensive method for detecting faults. The fault detection and classification system (FDC) is called Dynamic Fault Detection (DFD) in the cloud. It establishes trace references dynamically and does not rely solely on the traditional control limiting methods.
DFD also uses A.I. to develop smarter algorithms to better distinguish between real alarms and false alarms.
The company’s intelligent manufacturing solutions collect and manage data, monitor the health of equipment, optimize process flows, analyze large data, identify root cause failures to mitigate risk, predict issues before they occur and extend the life of equipment through predictive analytics. DFD enables semiconductor manufacturers to leverage A.I., Cloud, and Internet of Things (IoT) technologies to advance engineering productivity and more efficiently guard against events that harm yield.
According to the company, a cloud-based FDC system offers the same level of security as an on-premise system and can provide the same level of performance as an on-premise system given the advent of advanced networking technologies and a global infrastructure of high-bandwidth networks.
