The SD-15901 FBGA design provides a 34% smaller footprint and 35% less power dissipation than the previous generation, enabling SWaP optimization of PCB layout and ball grid array surface mounting.
November 22, 2019 – Data Device Corporation (DDC) introduced a redesigned version of its Synchro/Resolver two-speed combiner, now featuring 3.3V I/O within an FBGA (Fine Pitch Ball Grid Array) package. The SD-15901 FBGA design provides a 34% smaller footprint and 35% less power dissipation than the previous generation, enabling SWaP optimization of PCB layout and ball grid array surface mounting.
Using coarse and fine digital angle inputs, the combiner provides up to 22-bit angle resolution, making it suitable for position control systems requiring real-time precision resolution. Additionally, the SD-15901 is RoHS compliant, and rated for the full military temperature range (-55°C to +125°C).
