December 19, 2013 - FCI introduced the High Power Card Edge (HPCE) Board-to-board (BTB) connectors. This header and receptacle solution provides more options for customers looking for high current density board-to-board connectivity. Specifically designed for applications requiring a high current density and low power loss, this two-piece solution delivers up to 200Amps/linear inch, a low contact resistance of just 0.6mΩ per contact, within a compact design of just 7.5mm in height.
The power contacts and housings are made for demanding AC and DC power distribution applications, and are ideal for next generation 1U/2U servers, switches, storage enclosures, telecommunications equipment, industrial PCs, controls and instrumentation equipment. The HPCE BTB connectors are produced in a wide variety of configurations to serve a variety of applications. The integrated guide features enable ‘blind-mating’ which facilitates easy connectivity and precise alignment. The connector also features a highly ventilated housing design which enhances heat dissipation. This is a crucial feature in server and data storage applications, as it helps avert overheating issues, and increases the reliability of the end equipment.
The HPCE BTB connector offers power and signal density in a miniaturized board-to-board platform. Samples are available for immediate release.