December 2, 2016 - Saki has partnered with Fuji America to incorporate its 3D automated optical inspection (AOI) and 3D solder paste inspection (SPI) systems into Fuji's Smart Factory SMT line at its Vernon Hills, IL facility. Saki's inspection and measurement systems will be used to ensure that the printed circuit boards produced at Fuji adhere to the highest standards of quality and reliability.
Saki's BF-3Di AOI system inspects and measures the height of all devices on a printed circuit board and detects defects such as lifted leads, tombstones, reverses, and height variations at high speeds and cycle times. Saki's 3D BF-3Si SPI system is a 2-projector solder paste inspection system. Its Phase Measurement Profilometry with Liquid Crystal on Silicon (LCoS) technology ensures repeatability of inspection results.
Saki is part of Fuji Machine Manufacturing's Smart Factory with Nexim initiative that standardizes the communication protocol between Saki's SPI and AOI machines and Fuji's component placement machines to create a manufacturing line that extends beyond the boundaries of corporations.
