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Hectronic announces H6818 COM Express module

07 December, 2012
H6818 is based on third generation Intel Core i3/i5/i7 processors (also called Ivy Bridge) and the new Mobile Intel QM77 Express chipset.

December 7, 2012: Hectronic announced the H6818, a Computer-on-Module, COM in the COM Express Compact form factor and based on third generation Intel Core i3/i5/i7 processors (also called Ivy Bridge) and the new Mobile Intel QM77 Express chipset. The combination offers increased performance per watt and improved graphics and media processing capabilities compared with previous generation Intel Core i3/i5/i7. H6818 supports COM Express revision 2.1 and pin-out type 6 for full utilization of the advantages in the processor platform.

The improved graphics in the new Intel Core i3/i5/i7 includes Intel HD Graphics 4000, support for DirectX 11 and OpenGL 3.1. The pin-out type 6 is adapted to embedded applications requiring increased graphics performance and allows support for three independent displays in any combination of VGA, LVDS and DDI (HDMI, DVI, and DisplayPort) directly from the module. Intel Quick Sync 2.0 improves the abilities for video transcoding.

Performance orientated applications within Datacom/Telecom, Defence, Simulation and Industrial Automation will benefit from the improved computing performance of H6818.

H6818 has extensive I/O capabilities based on features in the Mobile Intel QM77 Express chipset. USB 3.0 increases data transfer speeds to and from the system.

H6818 provides 4 USB 3.0/2.0, 4 USB 2.0, 2 SATA 3.0 ports with speed up to 6Gb/s, 2 SATA 2.0 ports with up to 3Gb/s, 1 SMBus, 1 I2C, and 4-bit input and 4-bit output GPIO for device controls.

Additional expansion possibilities are 1 PCIe x16 slot, for instance for a video capture card or a high-end graphics card, and 1 PCIe x4 and 3 PCIe x1 or 7 PCIe x1 slot.

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