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IBASE introduces IBR115 2.5-inch SBC and the IBR117 3.5-inch SBC

By: IBASE Technology Inc.
20 July, 2018
IBASE introduces IBR115 2.5-inch SBC and the IBR117 3.5-inch SBC
IBASE introduces IBR115 2.5-inch SBC and the IBR117 3.5-inch SBC
IBR115 and IBR117 are scalable SBCs with extended operating temperature support of -40°C to 85°C and an optional heatsink. Supporting 1GB DDR3 memory on board, the boards provide a number of interfaces for HDMI and single LVDS display interface, 4GB eMMC, Micro SD, COM, GPIO, USB, USB-OTG, Gigabit Ethernet and a M.2 Key-E interface.

July 20, 2018 - IBASE Technology Inc. a manufacturer of industrial computer solutions, announced two SBCs, both powered by an NXP i.MX 6Dual Cortex-A9 1.0GHz high performance processor.

The IBR115 2.5-inch SBC and the IBR117 3.5-inch SBC are designed for use in applications in the automation, smart building, transportation, and medical markets.

IBR115 and IBR117 are scalable SBCs with extended operating temperature support of -40°C to 85°C and an optional heatsink. Supporting 1GB DDR3 memory on board, the boards provide a number of interfaces for HDMI and single LVDS display interface, 4GB eMMC, Micro SD, COM, GPIO, USB, USB-OTG, Gigabit Ethernet and a M.2 Key-E interface. These embedded I/Os provide connection to peripherals such as WiFi, Bluetooth, GPS, storage, displays, and camera sensors for use in a variety of application environment while consuming levels of power far lower than industry expectations.

IBR115 and IBR117 come with Yocto 2.0 and Android 6.0 Board Support Package (BSP) to help customers reduce development time and designs costs, as well as accelerate time to market. The IBR117 has an additional single-channel LVDS (a total of two LVDS), two USB ports, one mini-PCIE with SIM socket, and two CAN Bus 2.0B headers.

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