November 12, 2008 - ITT Interconnect Solutions launched a family of high density, low profile connectors. Designated the NDD Series, the connectors offer a robust solution for applications where size and weight are limited. The NDD Series connectors meet all MIL-DTL-32139 specifications.The NDD Series nano miniature connectors feature 0.635mm pitch contact spacing, allowing for high signal density in minimal space.
The connectors also utilize ITT's proven micro twist pin technology, featuring five points of electrical contact and high-reliability crimp joints to ensure signal integrity and provide superior and reliable performance in harsh environments.The high density, low profile connectors are capable of withstanding vibration up to 20G and shock up to 100G, and feature 48-hour salt spray corrosion resistance.Contact rating for the nano miniature connectors is 1A, with a maximum contact resistance rating of 71mV drop. Withstanding voltage is 250VAC RMS at sea level and 100VAC RMS at 70,000 feet. The connector is insulated by high temperature LCP dielectric materials.
Operating temperature ranges from -55°C to +125°C.The NDD Series connectors can be mounted directly to a PC board with a through-hole mating plug connector. Surface mount versions are also in development. Cable harnesses are available in discrete insulated wires, ribbon cable and flex circuit terminations.
About ITT Interconnect Solutions
ITT Interconnect Solutions is an international manufacturer and supplier of connectors including circular, rectangular, fiber optic, RF, power and high voltage, audio, PCMCIA, Compact Flash Card, enclosures, cable assemblies, and application specific custom solutions. The Interconnect Solutions portfolio includes the brands Cannon, VEAM, and BIW.
