March 13, 2015 - Micro-Epsilon announces that its MEMS-based (Micro Electro Mechanical Systems) acceleration, inclination (tilt angle) and shock/vibration sensors can be custom-engineered in low-to-medium volumes to suit specific OEM, R&D or machine build applications.
MEMS, the technology of very small devices, typically comprise of components between 1 to 100 micrometres in size. MEMS usually consist of a central unit that processes data (the microprocessor) and several components that interact with the surroundings such as micro-sensors. Micro-Epsilon UK can supply OEMs and machine builders with MEMS acceleration, inclination and vibration sensors, in small-to-medium volumes, customised to suit individual requirements, including a variety of connections, output signals and mounting options.
Chris Jones, Managing Director at Micro-Epsilon UK comments: “Micro-Epsilon UK can supply custom sensors in low-to-medium volumes, which better meets the needs of the OEM and machine building markets in the UK. We can assist customers with upfront design and development support, as well as advice on single system components such as the sensor element, the interface to their own systems and the housing.”
The sensors are based on high performance MEMS acceleration sensors that are suitable for harsh environments, providing both high precision and high measurement repeatability. The measuring element itself consists of a pendulum, whose static and dynamic movements are measured using the capacitive measurement method. Made from high purity silicon, the measuring element is hermetically-sealed in glass and silicon, providing long term stability. A symmetrical design compensates for any temperature fluctuations caused by the expansion coefficient of the silicon.