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Micro-Measurements announces S5198 strain gage pattern for PCB testing

14 September, 2017
Micro-Measurements announces S5198 strain gage pattern for PCB testing
Micro-Measurements announces S5198 strain gage pattern for PCB testing
Offered in two strain gage designations (C5K-XX-S5198-350/33F and C5K-XX-S5198-350/39F), the Micro-Measurements S5198 pattern provides strain detection with minimized non-uniform PCA strain gradient effects, along with operation to +200°C.

September 14, 2017 – The Micro-Measurements brand of Vishay Precision Group, announced the global market introduction of its S5198, a miniature rectangular planar rosette strain gage pattern for printed circuit board (PCB) testing, incorporating Advanced Sensors Technology. Offered in two strain gage designations (C5K-XX-S5198-350/33F and C5K-XX-S5198-350/39F), the Micro-Measurements S5198 pattern provides strain detection with minimized non-uniform PCA strain gradient effects, along with operation to +200°C. An overall footprint grid length of 0.36 millimeters, facilitates target board placement and integration. The S5198 pattern is further supported by pre-attached high-performance Teflon insulated flexible thin cables, consisting of three twisted wires per grid.

The wires are color coded, stripped and tinned for PCB wire routing and connection to data acquisition systems. In addition to PCB testing, the pattern is suitable for ball grid array (BGA) component testing, spherical bend testing, mechanical shock testing, PCB flexures, and in-circuit testing (ICT). The S5198 is RoHS compliant and is utilized in accordance with IPC–JEDEC 9702, IPC–JEDEC 9704, and JEDEC JESD22-B111 standards. The Micro-Measurements Advanced Sensors Technology portfolio includes linear, shear and circular strain gages, in individual, half- and full-bridge configurations and in ranges from 350 ‚Ѷ to 20 k‚Ѷ, with added flexibility in mounting options.

Application of this VPG proprietary technology improves grid-to-grid tolerances and matching over traditional strain gage manufacturing techniques. In the case of full-bridge gage configurations, all intra-bridge connections are integrated directly into the pattern itself, eliminating the need for traditional intra-bridge soldering.

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