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Microchip Technology announces MCP794XX Clock/Calendar IC

10 November, 2010
Microchip Technology announces MCP794XX Clock/Calendar IC
Microchip Technology announces MCP794XX Clock/Calendar IC
The devices include digital trimming for time-of-day calibration, and a battery-switchover feature that supports backup power at very low voltage and current levels.

November 10, 2010 - Microchip Technology announced MCP794XX stand-alone IC Real-Time Clock/Calendar (RTCC) family. All six MCP794XX devices are highly integrated at a low cost, including ample amounts of on-chip EEPROM and SRAM, as well as a user-lockable section of EEPROM available for a 64-bit reprogrammable unique ID that can be factory-programmed with a MAC address. The devices include digital trimming for time-of-day calibration, and a battery-switchover feature that supports backup power at very low voltage and current levels.

By integrating all of these features within a single device, the MCP794XX family reduces component count, and lowers costs for a variety of applications.Many applications require a real-time clock with back-up power to maintain time and alarm settings when the main power is turned off. Other applications, such as commercial refrigeration and security systems, need a real-time clock with a power-fail monitor to capture and store the timeframes when main power fails. With their on-chip battery-switchover circuit and power-fail timestamp, the MCP794XX RTCC devices deliver this functionality, helping to address system health, safety, and security concerns in applications involving the storage of perishable goods, or monitoring access to secure rooms.

The devices can be ordered with a pre-programmed MAC address, which eliminates a time-consuming step in the production flow, and the digital trimming feature can support software temperature compensation, which lowers costs in comparison to devices where temperature compensation takes place in hardware.

Packaging & Availability

All six MCP794XX RTCC devices are available in 8-pin MSOP, SOIC, TSSOP and TDFN packages.

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