February 4, 2015 - NEXCOM releases ICES 672 COM Express module that supports 5th generation Intel Core i7/i5/i3 processors which come in a multi-chip package (MCP). It has triple independent display support, 2D/3D imaging and video processing capabilities, and network connectivity on to a 95x95 mm footprint while consuming low power. The ICES 672 is geared toward compute- and graphics-intensive devices with size, weight, and power (SWaP) constraints. The CPU and platform control hub (PCH) are combined onto a single package with power consumption of only 15W.
The ICES 672 has dual SO-DIMM slots to support up to 16GB DDR3L 1600MHz memory and offers various display outputs (DisplayPort, HDMI, DVI, VGA), dual 18-/24 LVDS—LAN connection, and Wi-Fi/3.5G expansion through NEXCOM carrier board ICEB 8060. To facilitate rapid deployment of project designs, NEXCOM is offering ICEK 8060-T6 Starter Kit which includes NEXCOM type 6 COM Express compact module ICES 672, reference carrier board ICEB 8060, built-in 4GB system memory, pre-installed trial version of Microsoft Windows 7, bootable 8GB CFast-SSD, 10.4" LCD panel, and Flex ATX power supply. With the development toolkit, users can immediately assess the full set of I/O functions supported by ICES 672, quickly come up with design modifications, and therefore accelerate project implementation.
Features include:
5th generation Intel Core i7/i5/i3 processor Dual SO-DIMMs for up to 16GB of DDR3L 1600Mhz Support three independent displays with DisplayPort, HDMI, DVI, VGA, and dual 18-/24 LVDS outputs 2x USB 3.0, 8x USB 2.0, 4x SATA 3.0, 4x PCIex1, WDT, GPIO, I2C Dimension 95 x 95mm (WxL)
