November 9, 2010 - Nextreme Thermal Solutions introduces the eTEC HV56 thin-film thermoelectric cooler (TEC). At 85°C, the eTEC HV56 can pump 6 watts or 58 W/cm2 of heat in footprint of only 11 mm2.
The device is only 0.6mm high, making it the thinnest, highest heat pumping TEC on the market today.At 85°C, the eTEC HV56 can create a temperature differential Δ of up to 60°C between its hot and cold sides, and operates at a maximum voltage of 10.8V, making it compatible with commonly found board-level currents and voltages.
At 25°C, the device can create a Δ of up to 50°C with a maximum voltage of 8.8V.The eTEC HV56 is RoHS-compliant and is manufactured using gold-tin (AuSn) solder, which enables assembly temperatures as high as 320°C.
These assembly temperatures make the HV56 compatible with industry standard processes for packaging electronic devices that require tight tolerances.Applications include laser diode cooling, high-speed thermal test heads, and CPU hot spot cooling.Nextreme recommends the use of its thermal modeling, design and engineering services to deliver fully-optimized thermal management solutions. Nextreme routinely conducts analytical and numerical thermal modeling at all design levels from component to module to subsystem. Advanced analysis of complex systems, components or packages often requires more detailed modeling to understand heat flow and thermal gradients.
